tag: reliability

When You Can’t Afford To Scrimp On System Reliability
By Christine Young - 06 Aug, 2020 - Comments: 0

Failure happens, whether we like it or not. What’s important is to be prepared for failure to occur, which involves putting in place measures that allow us to quickly address or resolve the problem. But not all failures are created equally. For example, a laptop that you use daily might experience occasional glitches. If it’s well-designed, you can simply reset the machine to get it back to... » read more

Make Way For Flexible ICs
By Ed Sperling - 16 Jul, 2020 - Comments: 0

The push to develop intelligent sensors everywhere does not require everything to be on a silicon substrate. In fact, a growing part of the market increasingly is focused on flexible substrates. The market for printed sensors is roughly $3.6 billion today, according to a new report by IDTechEx. In a decade, that number is expected to grow to $4.5 billion, according to the firm, with growth i... » read more

Maximizing Value Post-Moore’s Law
By Brian Bailey - 13 Jul, 2020 - Comments: 0

When Moore's Law was in full swing, almost every market segment considered moving to the next available node as a primary way to maximize value. But today, each major market segment is looking at different strategies that are more closely aligned with its individual needs. This diversity will end up causing both pain and opportunities in the supply chain. Chip developers must do more with a ... » read more

Advanced Packaging Makes Testing More Complex
By Bryon Moyer - 07 Jul, 2020 - Comments: 1

The limits of monolithic integration, together with advances in chip interconnect and packaging technologies, have spurred the growth of heterogeneous advanced packaging where multiple dies are co-packaged using 2.5D and 3D approaches. But this also raises complex test challenges, which are driving new standards and approaches to advanced-package testing. While many of the showstopper issues... » read more

Monitoring IC Abnormalities Before Failures
By Anne Meixner - 07 Jul, 2020 - Comments: 0

The rising complexities of semiconductor processes and design are driving an increasing use of on-chip monitors to support data analytics from an IC’s birth through its end of life — no matter how long that projected lifespan. Engineers have long used on-chip circuitry to assist with manufacturing test, silicon debug and failure analysis. Providing visibility and controllability of inter... » read more

Data Becomes Key For Next-Gen Chips
By Susan Rambo And Ed Sperling - 07 Jul, 2020 - Comments: 1

Data has become vital to understanding the useful life of a semiconductor — and the knowledge gleaned is key to staying competitive beyond Moore’s Law. What's changed is a growing reliance earlier in the design cycle on multiple sources of data, including some from further right in the design-through-manufacturing flow. While this holistic approach may seem logical enough, the semiconduc... » read more

2020 CEO Outlook
By Ed Sperling - 25 Jun, 2020 - Comments: 0

Semiconductor Engineering sat down to discuss the semiconductor industry's outlook and what's changing with Simon Segars, CEO of Arm; Joseph Sawicki, executive vice president of IC EDA at Mentor, a Siemens Business; Raik Brinkmann, CEO of OneSpin Solutions; Babak Taheri, CEO of Silvaco; John Kibarian, CEO of PDF Solutions; and Prakash Narain, CEO of Real Intent. The conversation was part of the... » read more

Using ML In Manufacturing
By Ed Sperling - 23 Jun, 2020 - Comments: 0

How to prevent early life failures by applying machine learning to different use cases, and how to interpret models for different tradeoffs on reliability. Jeff David, vice president of AI solutions at PDF Solutions, digs down into how to utilize data to improve reliability. » read more

Spreading Out The Cost At 3nm
By Ed Sperling - 18 Jun, 2020 - Comments: 5

The current model for semiconductor scaling doesn't add up. While it's possible that markets will consolidate around a few basic designs, the likelihood is that no single SoC will sell in enough volume to compensate for the increased cost of design, equipment, mask sets and significantly more testing and inspection. In fact, even with slew of derivative chips, it may not be enough to tip the ec... » read more

Improving Reliability For GaN And SiC
By Mark LaPedus - 18 Jun, 2020 - Comments: 2

Suppliers of gallium nitride (GaN) and silicon carbide (SiC) power devices are rolling out the next wave of products with some new and impressive specs. But before these devices are incorporated in systems, they must prove to be reliable. As with previous products, suppliers are quick to point out that the new devices are reliable, although there are some issues that can occasionally surface... » read more

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