tag: reliability

Data Converters For Automotive Applications
By Manuel Mota - 04 Oct, 2018 - Comments: 0

Sensor applications requiring data converters range from temperature sensors identifying different engine status to radar/LIDAR enabling Automotive Driver Assistance Systems (ADAS). Other applications involving data converters include wireless transceivers for communicating with other vehicles or with a fixed network. The data converter IP (analog-to-digital and digital-to-analog) provides an i... » read more

Aging In Advanced Nodes
By Ann Mutschler - 17 Sep, 2018 - Comments: 0

Semiconductor Engineering sat down to discuss design reliability and circuit aging with João Geada, chief technologist for the semiconductor business unit at ANSYS; Hany Elhak, product management director, simulation and characterization in the custom IC and PCB group at Cadence; Christoph Sohrmann, advanced physical verification at Fraunhofer EAS; Magdy Abadir, vice president of marketing at ... » read more

Mission Profiles
By Jens Michael Warmuth - 13 Sep, 2018 - Comments: 1

In the field of electronic systems, the mission profile has been one of the key concepts since the start of the scientific examination of the subject of reliability. Its exact meaning varies with time and the industry using it. In particular, over the course of increasing digitalization and networking in the context of IoT and the opportunities resulting from this, the subject of mission profil... » read more

5 Reasons Why In-Chip Monitoring Is Here To Stay
By Ramsay Allen - 13 Sep, 2018 - Comments: 0

When the first car rolled off his production line in 1913, Henry Ford would have already envisioned just how prolific the automobile would become. However, would he have foreseen the extent to which monitors and sensors would become critical to the modern internal combustion engine? The requirement for energy efficiency, power performance and reliability in high volume manufactured vehicles ... » read more

Process Corner Explosion
By Ann Mutschler - 13 Sep, 2018 - Comments: 1

The number of corners that need to be checked is exploding at 7nm and below, fueled by everything from temperature and voltage to changes in metal. Lowering risk and increasing predictability of an SoC at those nodes starts with understanding what will happen when a design is manufactured on a particular foundry process, captured in process corners. This is basically a way of modeling what i... » read more

Cracking The Auto IC Market
By Ann Mutschler - 06 Sep, 2018 - Comments: 0

The market for automotive electronics is booming, and it has set off a global scramble among established chipmakers and startups. What's becoming clear, though, is that not everyone understands just how different automotive is from the mobile market. Mobile is still the highest-volume market for semiconductors, but the growth has flattened. In contrast, the value of the automotive electronic... » read more

The Rising Cost Of 5G
By Ed Sperling - 22 Aug, 2018 - Comments: 0

Semiconductor Engineering sat down to talk about challenges and progress in 5G with Yorgos Koutsoyannopoulos, president and CEO of Helic; Mike Fitton, senior director of strategic planning and business development at Achronix; Sarah Yost, senior product marketing manager at National Instruments; and Arvind Vel, director of product management at ANSYS. What follows are excerpts of that conversat... » read more

Aging Effects
By Ed Sperling - 17 Jul, 2018 - Comments: 0

Tech Talk: Fraunhofer EAS' group manager for quality and reliability, Andre Lange, talks about how to model aging effects and why the problems are becoming more difficult at advanced nodes. https://youtu.be/XHWww2PE7aY » read more

Toward Cross-Layer Resilience
By Ed Sperling - 28 Jun, 2018 - Comments: 0

Connected devices are everywhere, and the numbers are growing by orders of magnitude. There are 7 billion people on the planet, but there are expected to be many more billions of connected devices. Each person may have dozens of devices with multiple chips, and those will be connected through infrastructures filled with thousands of additional chips. The problem is that as everything gets c... » read more

Market And Tech Inflections Ahead
By Ed Sperling - 27 Jun, 2018 - Comments: 0

Aart de Geus, chairman and co-CEO of Synopsys, sat down with Semiconductor Engineering to talk about the path to autonomous vehicles, industry dis-aggregation and re-aggregation, security issues, and who's going to pay for chips at advanced nodes. SE: All of a sudden we have a bunch of new markets opening up for electronics. We have assisted and autonomous driving, AI and machine learning, v... » read more

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