tag: reliability

How Effective Power Management Increases The Lifetime Operation Of Portable Medical Devices
By Mentor, a Siemens Business - 09 Jul, 2014 - Comments: 0

To enable remote patient care and provide increased mobility in hospital settings portable medical devices, Personal Area Networks (PANs), and home health systems are seeing a significant increase in investment spending. When designing a portable medical device, decisions on processor and component selection are dependent on a range of variables which include performance, price, quality, and re... » read more

Is The Definition Of IC Reliability Changing?
By Matthew Hogan - 18 Jun, 2014 - Comments: 1

“You know, brain surgery's not difficult if you don't care whether the person dies, it's actually quite easy. Flying a plane is quite easy if you don't mind crashing. That's what hard means. It's an expression of how much you care about the result. And if you are proud of it, or you believe it can be good and you want it to be good, then it can be sort of infinitely hard, to the point where i... » read more

System-Aware SoC Power, Noise And Reliability Sign-off
By Ansys - 12 Jun, 2014 - Comments: 0

In globally competitive markets for mobile, consumer and automotive electronic systems, the critical success factors are power consumption, performance and reliability. To manage these conflicting requirements, design teams consider multiple options, including the use of advanced process technology nodes — especially FinFET-based devices. These advanced technology nodes allow chips to operate... » read more

New Approaches For Reliability
By Ed Sperling - 28 Mar, 2014 - Comments: 0

The definition of reliability hasn’t budged since the invention of the IC, but how to achieve it is starting to change. In safety-critical systems, as well as in markets such as aerospace, demands for reliability are so rigorous that they often require redundant circuitry—and for good reason. A PanAmSat malfunction in 1998 caused by tin whisker growth wiped out pagers for 45 million use... » read more

Flawed Research?
By Brian Bailey - 09 Dec, 2013 - Comments: 0

Soft errors were first talked about a long time ago and [getkc id="22" kc_name="memories"], which are the most susceptible to this type of error due to their finer geometries and tighter packing, have long included protection from such errors. But the scare has proven to be larger than the real problem. However, as geometries shrink, we are again hearing about the potential problems. Researc... » read more

Executive Briefing: Andrew Yang
By Ed Sperling - 09 May, 2013 - Comments: 0

By Ed Sperling Andrew Yang, president of ANSYS subsidiary Apache Design, sat down with Low-Power/High-Performance Engineering to talk about why power is becoming so important and where the future challenges lie. What follows are excerpts of that conversation. LPHP: What’s the most important issue these days for chipmakers? Yang: According to the feedback we’ve gotten from our customer... » read more

Challenges In IC And Electronic Systems Verification
By Aveek Sarkar - 09 May, 2013 - Comments: 0

Power efficiency, unrealistic schedules, and cost-down considerations are increasingly the top challenges design teams must meet to deliver next generation electronic systems, whether it is for the mobile, server, or automotive market. In addition, a successful chip tapeout does not guarantee the eventual end-product’s success—there are many variables to take into account. In the first p... » read more

New Issues In Signoff
By Ed Sperling - 14 Feb, 2013 - Comments: 0

By Ed Sperling Signoff has always been a challenge at every stage of an SoC design flow. No matter how good a design looks, or how well a prototype works, there are still problems that can crop up at any stage of the design flow all the way into manufacturing that can leave engineering teams shaking their heads. Even at mainstream process nodes, respins are common. At advanced nodes—part... » read more

Leveraging The Past
By Ed Sperling - 28 Jun, 2012 - Comments: 0

By Ann Steffora Mutschler It’s easy to forget that not every design today is targeted at 20nm, given the amount of focus put on the bleeding edge of technology. But in fact a large number of designs utilize the stability and reliability of older manufacturing nodes, as well as lower mask costs, by incorporating new design and verification techniques, with 2.5D designs being a prime example. ... » read more

Experts At The Table: The Reliability Factor
By Ed Sperling - 28 Jan, 2010 - Comments: 0

Low-Power Engineering sat down to discuss reliability with Ken O’Neill, director of high reliability product marketing at Actel; Brani Buric, executive vice president at Virage Logic; Bob Smith, vice president of marketing at Magma, and John Sanguinetti, chief technology officer at Forte Design Systems. What follows are excerpts of that conversation. LPE: Is a more complex supply chain cau... » read more

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