Software-Defined Vehicles Ready To Roll


Software-defined vehicles are driving a swell of activity across the automotive ecosystem, including new methodologies and technology approaches that could significantly reduce costs and shorten time to market for advanced features. The SDV approach encompasses more than a single concept. It helps to think of it more as a modeling approach that connects EVs, driver assistance technology, and... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan. Cadence introduced an AI-based thermal stress and analysis platform aimed at 2.5D and 3D-ICs, and cooling for PCBs and electronic assemblies. The company also debuted a HW/SW accelerated digital twin solution for multi-physics system design and analysis, combining GPU-resident computational fluid dynamics (CFD) solvers with dedicated GPU hardwar... » read more

Companies That Embrace Digital Transformation Have More Resilient Design And Supply Chains


Digital transformation has evolved quickly from a conceptual phase to a semiconductor industry change agent. The rapid take up of AI-enhanced product development is only accelerating this transformation and is further influenced by two connected trends: The movement of Moore’s Law from transistor scaling to system-level scaling, and the relatively recent redistribution of the global electroni... » read more

Build Secured And Cost Effective Next-Generation Actuator And Sensor Applications Based On The Latest E/E Architectures


Automotive E/E architectures have undergone remarkable changes in recent years influencing actuator and sensor applications such as body control (lights, windows, and mirrors, etc.), motor control such as engine pumps and fans, and sensor control. Traditionally, these applications have used small and low-cost 16-bit microcontrollers (MCUs) but now they need more advanced 16-bit MCUs. In this wh... » read more

Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Susan Rambo UMC and Intel will collaborate on the development of a 12nm semiconductor process platform to address high-growth markets, such as mobile, communications infrastructure, and networking. Apple reportedly pushed back the launch date of its long-awaited electric vehicle and scaled back the self-driving features to L2 driver assistance, according ... » read more

Chip Industry Week In Review


By Jesse Allen, Gregory Haley, and Liz Allan Synopsys will acquire Ansys for about $35 billion in cash and stock. The deal will boost Synopsys' multi-physics simulation capabilities, which are essential for complex 3D-IC designs, where thermal density can have significant repercussions. The acquisition is expected to be finalized in the first half of 2025. Worldwide semiconductor revenue ... » read more

Chip Industry Week In Review


By Susan Rambo, Jesse Allen, and Liz Allan The U.S. government will provide about $162 million in federal incentives, under the CHIPS and Science Act, to help Microchip onshore its semiconductor supply chain. The move is aimed at securing a reliable domestic supply of MCUs and mature-node chips. “Today’s announcement will help propel semiconductor manufacturing projects in Colorado and O... » read more

Money Pours Into New Fabs And Facilities


Fabs, packaging, test and assembly, and R&D all drew major funding in 2023. Companies poured money into offshore locations, such as India and Malaysia, to access a larger workforce and lower costs, while also partnering with governments to secure domestic supply chains amid ongoing geopolitical turmoil. Looking ahead, artificial intelligence (AI), quantum computing, and data applications... » read more

Chip Industry Week In Review


By Jesse Allen, Karen Heyman, and Liz Allan More than 1 billion generative AI smartphones are expected be shipped during 2024 to 2027, reports Counterpoint. The share of GenAI smartphones will be 4% of the market in 2023 and is likely to double in 2024, with Samsung capturing half the market, followed by Chinese OEMs. By 2027, GenAI smartphones could account for 40% of the market. Global ... » read more

Blog Review: Dec. 20


Siemens' Huw Geddes finds that the flexibility offered by the RISC-V ISA can introduce further verification and validation requirements to ensure that the combination of extensions and customization not just works but does not break anything else while delivering expected performance, plus looks at how processor trace can help. Cadence's Gustavo Araujo explains the various optimizations in t... » read more

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