tag: Renesas

Protecting Highly Confidential Data In IoT Devices
By Masaki Hama - 05 Oct, 2023 - Comments: 0

How should we approach the protection of highly confidential security parameters and personal data? It's just like our daily routines: when we leave home, we lock the door and take care not to lose the key. Similarly, in the realm of cybersecurity, safeguarding cryptographic keys is paramount. No matter how robust your data protection system is, it's rendered ineffective if keys or passwords... » read more

Data Collection For Edge AI / Tiny ML With Sensors
By Renesas - 04 Oct, 2023 - Comments: 0

Reality AI software from Renesas provides solution suites and tools for R&D engineers who build products and internal solutions using sensors. Working with accelerometers, vibration, sound, electrical (current/voltage/ capacitance), radar, RF, proprietary sensors, and other types of sensor data, Reality AI software identifies signatures of events and conditions, correlates changes in signat... » read more

Blog Review: October 4
By Jesse Allen - 04 Oct, 2023 - Comments: 0

Cadence's Felipe Goncalves checks out the Integrity and Data Encryption (IDE) feature in PCIe 6.0, a new layer inserted between the transection layer and data link layer with the goal of protecting against threats from physical attacks on the link. Siemens' Robin Bornoff, Daniel Berger, and Kai Liu explore the potential for large language models (LLMs) make the use of CAE tools simpler, more... » read more

Chip Industry Week In Review
By The SE Staff - 29 Sep, 2023 - Comments: 0

By Susan Rambo, Liz Allan, and Gregory Haley. TSMC rolled out the second version of its 3Dblox, which creates an infrastructure for stacking chiplets and other necessary components in a package, along with a standardized way of achieving that. Two novel features are chiplet mirroring for design reuse, and what is basically sandbox for power and thermal analysis of different design elements. ... » read more

ReRAM Seeks To Replace NOR
By Karen Heyman - 25 Sep, 2023 - Comments: 0

Resistive RAM is gaining renewed attention as demand for faster and cheaper non-volatile memory alternatives continues to grow, particularly in applications such as automotive. Embedded flash has long left designers wishing for better write speeds and lower energy consumption, but as the leading edge of that technology shrunk to 28nm, another problem arose. Manufacturing flash memory at thos... » read more

Chip Industry Week In Review
By The SE Staff - 22 Sep, 2023 - Comments: 0

By Jesse Allen, Karen Heyman, and Liz Allan The U.S. Department of Defense (DOD) announced $238 million in awards toward establishing eight regional innovation hubs under the CHIPS and Science Act. The hubs aim to accelerate hardware prototyping and "lab-to-fab" transition of semiconductor technologies for secure edge/IoT, 5G/6G, AI hardware, quantum technology, electromagnetic warfare, and ... » read more

Blog Review: September 20
By Jesse Allen - 20 Sep, 2023 - Comments: 0

Siemens' Patrick Hope considers the unique attributes of materials used in flex and rigid-flex PCB designs and how they are constructed. Synopsys' Kenneth Larsen and Shekhar Kapoor find that the increased impact of thermal, signal integrity, and other multi-physics effects on multi-die systems calls for looking at the whole system, from technology to dies and package together. Cadence's V... » read more

Chip Industry Week In Review
By The SE Staff - 15 Sep, 2023 - Comments: 0

By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

Patterns And Issues In AI Chip Design
By Ed Sperling - 14 Sep, 2023 - Comments: 2

AI is becoming more than a talking point for chip and system design, taking on increasingly complex tasks that are now competitive requirements in many markets. But the inclusion of AI, along with its machine learning and deep learning subcategories, also has injected widespread confusion and uncertainty into every aspect of electronics. This is partly due to the fact that it touches so many... » read more

Blog Review: September 13
By Jesse Allen - 13 Sep, 2023 - Comments: 0

Siemens' Todd Westerhoff highlights the importance of signal integrity analysis in PCB design, challenges as simulation tools have become more sophisticated and difficult to use, and best practices like starting with a simple analysis problem. Synopsys' Rita Horner, Shekhar Kapoor, and William Ruby note that the power and thermal profiles of multi-die systems for HPC and the data center shou... » read more

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