tag: ReRAM

Non-Stateful Logic Gates in ReRAM (RWTH Aachen, FZJ)
By Technical Paper Link - 08 Nov, 2024 - Comments: 0

A new technical paper titled "Experimental Verification and Evaluation of Non-Stateful Logic Gates in Resistive RAM" was published by researchers at RWTH Aachen University and Forschungszentrum Jülich GmbH (FZJ). Abstract "Resistively switching, non-volatile memory devices facilitate new logic paradigms by combining storage and processing elements. Several non-stateful concepts such as Sco... » read more

Research Bits: Sept. 24
By Jesse Allen - 24 Sep, 2024 - Comments: 0

Modeling negative capacitance Researchers from Lawrence Berkeley National Laboratory developed an open-source 3D simulation framework capable of modeling the atomistic origins of negative capacitance in ferroelectric thin films at the device level. When a material has negative capacitance, it can store a greater amount of electrical charge at lower voltages. The team believes the FerroX fra... » read more

NeuroHammer Attacks on ReRAM-Based Memories
By Technical Paper Link - 21 Jun, 2024 - Comments: 0

A new technical paper titled "NVM-Flip: Non-Volatile-Memory BitFlips on the System Level" was published by researchers at Ruhr-University Bochum, University of Duisburg-Essen, and Robert Bosch. Abstract "Emerging non-volatile memories (NVMs) are promising candidates to substitute conventional memories due to their low access latency, high integration density, and non-volatility. These super... » read more

Memory On Logic: The Good And Bad
By Brian Bailey - 11 Apr, 2024 - Comments: 0

The chip industry is progressing rapidly toward 3D-ICs, but a simpler step has been shown to provide gains equivalent to a whole node advancement — extracting distributed memories and placing them on top of logic. Memory on logic significantly reduces the distance between logic and directly associated memory. This can increase performance by 22% and reduce power by 36%, according to one re... » read more

Building CFETs With Monolithic And Sequential 3D
By Katherine Derbyshire - 22 Feb, 2024 - Comments: 0

Successive versions of vertical transistors are emerging as the likely successor to finFETs, combining lower leakage with significant area reduction. A stacked nanosheet transistor, introduced at N3, uses multiple channel layers to maintain the overall channel length and necessary drive current while continuing to reduce the standard cell footprint. The follow-on technology, the CFET, pushes... » read more

Developing ReRAM As Next Generation On-Chip Memory For Machine Learning, Image Processing And Other Advanced CPU Applications
By Brett Lowe - 18 Jan, 2024 - Comments: 0

In modern CPU device operation, 80% to 90% of energy consumption and timing delays are caused by the movement of data between the CPU and off-chip memory. To alleviate this performance concern, designers are adding additional on-chip memory to their CPUs. Traditionally, SRAM has been the most widely used on-chip CPU memory type. Unfortunately, SRAM is currently limited to a size of hundreds of ... » read more

3D Integration Supports CIM Versatility And Accuracy
By Katherine Derbyshire - 18 Jan, 2024 - Comments: 0

Compute-in-memory (CIM) is gaining attention due to its efficiency in limiting the movement of massive volumes of data, but it's not perfect. CIM modules can help reduce the cost of computation for AI workloads, and they can learn from the highly efficient approaches taken by biological brains. When it comes to versatility, scalability, and accuracy, however, significant tradeoffs are requir... » read more

SRAM’s Role In Emerging Memories
By Karen Heyman - 05 Jan, 2024 - Comments: 1

Experts at the Table — Part 3: Semiconductor Engineering sat down to talk about AI, the latest issues in SRAM, and the potential impact of new types of memory, with Tony Chan Carusone, CTO at Alphawave Semi; Steve Roddy, chief marketing officer at Quadric; and Jongsin Yun, memory technologist at Siemens EDA. What follows are excerpts of that conversation. Part one of this conversation can be ... » read more

Increasing AI Energy Efficiency With Compute In Memory
By Katherine Derbyshire - 16 Nov, 2023 - Comments: 0

Skyrocketing AI compute workloads and fixed power budgets are forcing chip and system architects to take a much harder look at compute in memory (CIM), which until recently was considered little more than a science project. CIM solves two problems. First, it takes more energy to move data back and forth between memory and processor than to actually process it. And second, there is so much da... » read more

Novel NVM Devices and Applications (UC Berkeley)
By Technical Paper Link - 06 Oct, 2023 - Comments: 0

A dissertation titled “Novel Non-Volatile Memory Devices and Applications” was submitted by a researcher at University of California Berkeley. Abstract Excerpt "This dissertation focuses on novel non-volatile memory devices and their applications. First, logic MEM switches are demonstrated to be operable as NV memory devices using controlled welding and unwelding of the contacting electro... » read more

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