tag: RF

Inside The 5G Smartphone
By Mark LaPedus - 20 Aug, 2015 - Comments: 3

Amid a slowdown in the cell phone business, the market is heating up for perhaps the next big thing in wireless—5th generation mobile networks or 5G. In fact, major carriers, chipmakers and telecom equipment vendors are all rushing to get a piece of the action in 5G, which is the follow-on to the current wireless standard known as 4G or long-term evolution (LTE). Intel, Samsung and Qualcom... » read more

Challenges At Advanced Nodes
By Ed Sperling - 23 Jul, 2015 - Comments: 1

Semiconductor Engineering sat down to discuss finFETs, 22nm FD-SOI and how the how the market will segment over the next few years with Marie Semeria, CEO of [getentity id="22192" e_name="Leti"]; Patrick Soheili, vice president of product management and corporate development at [getentity id="22242" e_name="eSilicon"]; Paul Boudre, CEO of Soitec; and Subramani Kengeri, vice president of global ... » read more

Tech Talk: 22nm FD-SOI
By Ed Sperling - 13 Jul, 2015 - Comments: 0

Subramani Kengeri, vice president of global design solutions at GlobalFoundries, discusses the evolution of 22nm FD-SOI and its advantages, including single patterning in the middle end of line, 0.4 volt operating voltage, and how it compares to finFETs in terms of performance. [youtube vid=5fa1AcIGcUw] » read more

Moore Memory Problems
By Brian Bailey - 09 Jul, 2015 - Comments: 0

The six-transistor static memory cell (SRAM) has been the mainstay of on-chip memory for several decades and has stood the test of time. Today, many advanced SoCs have 50% of the chip area covered with these memories and so they are critical to continued scaling. “The SRAM being used in modern systems is similar to the SRAM they were using in the 1970s and 1980s,” says Duncan Bremner, ch... » read more

Electronic Labeling Takes Off
By Emerson Hsiao - 06 Jul, 2015 - Comments: 0

One hit product for the Internet of Things (IoT) market is the electronic shelf label (ESL). The ESL is rapidly replacing the paper price labels on store shelves throughout Europe and Asia, as well as within retail giants such as Walmart in the United States. But why are retailers replacing nearly zero cost paper labels with an electronic widget that sells for on the order of $5 each (prici... » read more

Power/Performance Bits: June 2
By Jesse Allen - 02 Jun, 2015 - Comments: 0

Printing RF antennas with graphene ink Researchers from the University of Manchester, together with BGT Materials Limited, a graphene manufacturer in the United Kingdom, printed a radio frequency antenna using compressed graphene ink. The antenna performed well enough to make it practical for use in RFID tags and wireless sensors, the researchers said. Even better, the antenna is flexible, e... » read more

Next-Generation Parasitic Extraction For 16nm And Beyond
By Mentor, a Siemens Business - 21 May, 2015 - Comments: 0

Advanced nodes and innovative process features such as finFET transistors require a leap forward in the performance and accuracy of analysis tools. The new Calibre xACT solution is a high-performance, high-accuracy parasitic extraction tool architected from the top-down for diverse IC design styles at advanced nodes. The Calibre xACT product delivers reference-level accuracy for leading-edge fi... » read more

High-Performance Analog And RF Circuit Simulation Using The Analog FastSPICE Platform At Columbia University
By Mentor, a Siemens Business - 22 Apr, 2015 - Comments: 0

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Areas of research include design techniques for circuits operating below 1 V, digitally calibrated RF front ends for superior linearity performance, LO synthesizers for wireless applications,... » read more

High-Performance Analog And RF Circuit Simulation Using The Analog FastSPICE Platform At Columbia University
By Mentor, a Siemens Business - 08 Apr, 2015 - Comments: 0

The research group led by Professor Peter Kinget at the Columbia University Integrated Systems Laboratory (CISL) focuses on cutting edge analog and RF circuit design using digital nanoscale CMOS processes. Areas of research include design techniques for circuits operating below 1 V, digitally calibrated RF front ends for superior linearity performance, LO synthesizers for wireless applications,... » read more

Modeling High-Performance Analog And RF Circuits In Nanometer-Scale CMOS
By Mentor, a Siemens Business - 12 Mar, 2015 - Comments: 0

By Mick Tegethoff and David Lee Today’s consumer, communication, and computer electronic devices have clocks, communication interfaces, and high-speed signal-conditioning circuits that operate at radio frequencies (RF). Providing price-competitive products often requires monolithic integration of these circuits in low-power nanometer-scale bulk CMOS silicon. This is a worst-case scenario for... » read more

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