Fan-Out Packaging Gets Competitive


Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds, it creates lower thermal resistance, a slimmer package, and potentially lower costs. Yet, if the h... » read more

Equipment Suppliers Brace For GaN Market Explosion


A huge GaN market is opening up, driven by consumer devices and the need for greater energy efficiency across many applications. Suppliers are ready, but to fully compete with SiC in high-voltage automotive applications will require further technological developments in power GaN (gallium nitride). Still, the 2020s mark a very high-growth phase for GaN markets. Revenues in the power GaN mark... » read more

The Great Migration To 5G Is Underway


Every decade brings with it a plethora of technology changes, and the cumulative effects of 50+ years of changes in wireless technologies are noteworthy for how they have changed the way we communicate. The 80’s began the era of personal computing along with 1G rollout The 90’s saw the advent of 64-bit microprocessor architecture in consumer devices coinciding with 2G rollout The... » read more

A Look Inside RF Design


RF EDA continues pushing the boundaries for today’s complex system designs. Connected workflows are creating shift left opportunities for engineering in virtual space. RF and microwave architects and designers can accelerate design and verification with powerful electromagnetic (EM) modeling and simulation technology. In the webinar for the 2023 launch of PathWave Advanced Design System (ADS)... » read more

IMS2022 Booth Tour: EDA And Measurement Science Converge


At the IEEE MTT-S International Microwave Symposium (IMS) 2022, the theme was “Explore the Peaks of Microwave Engineering,” a play on the event’s Denver location. There’s another clever interpretation – exploring the peaks encountered in high peak-to-average power ratio (PAPR) conditions with complex modulation. These modulated signals are driving Keysight’s vision where EDA and dig... » read more

High-Performance 5G IC Designs Need High-Performance Parasitic Extraction


By Karen Chow and Salma Ahmed Elhenedy We are rapidly approaching a future where 5G telecommunications will be the norm. With its increased data speeds and bandwidth, 5G has the potential to change the way we live our lives. But what does that mean for the average person? Think about cellphones, for one. You don't just use your phone for calling or texting anymore—you surf the web, chec... » read more

The Essential Signal Generator Guide Building A Solid Foundation In RF — Part 1


Eliminate uncertainties and doubts from your test results with a reliable signal source. Engineers designing consumer wireless, military communications, or radar devices face an ongoing bandwidth crunch in spectrum filled with interference. An accurate signal generator offers precise and stable test signals for characterizing your device under test (DUT). It also lets you apply impairments t... » read more

Bringing RFIC Design And Verification Into The Modern Era


For decades, developers of radio frequency (RF) chips and other analog/mixed-signal (AMS) integrated circuits (ICs) have used traditional techniques for design and verification. Most RFIC designers have continued to hand-craft active and passive devices, manually place and route their circuits, and rely on the bring-up lab to validate their pre-silicon SPICE simulations. It is often said that a... » read more

EDA Software Design Flow Considerations For The RF/Microwave Module Designer


Miniaturization of consumer products, aerospace and defense systems, medical devices, and LED arrays has spawned the development of a technology known as the multi-chip module (MCM), which combines multiple integrated circuits (ICs), semiconductor die, and other discrete components within a unifying substrate for use as a single component. This white paper outlines the steps for implementing an... » read more

Measuring Frequency Dependence Across 5G mmWave Bands (NIST)


New research paper from NIST, "Methodology for Measuring the Frequency Dependence of Multipath Channels Across the Millimeter-Wave Spectrum." Abstract "Millimeter-wave (mmWave) communications promise Gigabit/s data rates thanks to the availability of large swaths of bandwidth between 10–100 GHz. Although cellular operators prefer the lower portions of the spectrum due to popular belief ... » read more

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