tag: Rice University

Engineering chirality at wafer scale with ordered CNT architecture (Rice University and others)
By Technical Paper Link - 29 Nov, 2023 - Comments: 0

A new technical paper titled "Engineering chirality at wafer scale with ordered carbon nanotube architectures" was published by researchers at Rice University, University of Utah, J.A. Woollam Co. and Tokyo Metropolitan University. Abstract "Creating artificial matter with controllable chirality in a simple and scalable manner brings new opportunities to diverse areas. Here we show two su... » read more

Week In Review: Auto, Security, Pervasive Computing
By Liz Allan - 01 Sep, 2023 - Comments: 0

The U.S. Department of Energy (DOE) announced $15.5 billion in funding and loans for retooling existing automotive factories for the transition to electric vehicles (EVs) and supporting local jobs, plus a notice of intent for $3.5 billion in funding to expand domestic manufacturing of batteries for EVs and the nation’s grid, and for battery materials and components that are currently imported... » read more

Security Research: Technical Paper Round-up
By Linda Christensen - 29 Aug, 2023 - Comments: 0

A number of hardware security-related technical papers were presented at the August 2023 USENIX Security Symposium. Here are some highlights with associated links. [table id=130 /] A complete listing of all papers presented at this summer's USENIX conference can be found here and here. The organization provides open access research, and the presentation slides and papers are free to the p... » read more

Remote Direct Memory Introspection (Rice, Duke, MIT)
By Technical Paper Link - 22 Aug, 2023 - Comments: 0

A technical paper titled "Remote Direct Memory Introspection" was published by researchers at Rice University, Duke University, and MIT. This paper won a distinguished paper award at the recent 32nd USENIX Security Symposium. Abstract: "Hypervisors have played a critical role in cloud security, but they introduce a large trusted computing base (TCB) and incur a heavy performance tax. As of... » read more

Week In Review: Automotive, Security and Pervasive Computing
By Linda Christensen - 18 Aug, 2023 - Comments: 0

The AAA Foundation for Traffic Safety estimates that between 2021 and 2050, ADAS technologies currently available to U.S. will prevent "approximately 37 million crashes, 14 million injuries, and nearly 250,000 deaths, which would represent 16% of crashes and injuries, and 22% of deaths that would otherwise occur on U.S. roads without these technologies," according to a new report. Governmen... » read more

DAC/Semicon West Addresses Top Issues, Trends For Chips
By The SE Staff - 12 Jul, 2023 - Comments: 0

The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, drawing in more attendees and sponsor companies than since before the pandemic. At times, booth traffic was four to five deep, blocking aisles, and standing room only was common at presentations. Hot topics included generative AI and the underlying semiconductor technology, data security, reliabili... » read more

Chip Industry’s Technical Paper Roundup: Mar. 28
By Linda Christensen - 28 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=89 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Interconnects: Exploring Semi-Metals (Penn State, IBM, Rice University)
By Technical Paper Link - 26 Mar, 2023 - Comments: 0

A technical paper titled "Exploring Topological Semi-Metals for Interconnects" was published by researchers at Penn State, IBM, and Rice University, with funding by Semiconductor Research Corporation (SRC). Abstract "The size of transistors has drastically reduced over the years. Interconnects have likewise also been scaled down. Today, conventional copper (Cu)-based interconnects face a ... » read more

Chip Industry’s Technical Paper Roundup: Jan. 31
By Linda Christensen - 31 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library. [table id=77 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting l... » read more

3-Terminal Thermal Transistor With Thermal Measurements For The Switching And Amplification
By Technical Paper Link - 29 Jan, 2023 - Comments: 1

A technical paper titled "A three-terminal magnetic thermal transistor" was published my researchers at Rice University (Texas). Abstract "Three-terminal thermal analogies to electrical transistors have been proposed for use in thermal amplification, thermal switching, or thermal logic, but have not yet been demonstrated experimentally. Here, we design and fabricate a three-terminal magneti... » read more

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