tag: Rice University

Remote Direct Memory Introspection (Rice, Duke, MIT)
By Technical Paper Link - 22 Aug, 2023 - Comments: 0

A technical paper titled "Remote Direct Memory Introspection" was published by researchers at Rice University, Duke University, and MIT. This paper won a distinguished paper award at the recent 32nd USENIX Security Symposium. Abstract: "Hypervisors have played a critical role in cloud security, but they introduce a large trusted computing base (TCB) and incur a heavy performance tax. As of... » read more

Week In Review: Automotive, Security and Pervasive Computing
By Linda Christensen - 18 Aug, 2023 - Comments: 0

The AAA Foundation for Traffic Safety estimates that between 2021 and 2050, ADAS technologies currently available to U.S. will prevent "approximately 37 million crashes, 14 million injuries, and nearly 250,000 deaths, which would represent 16% of crashes and injuries, and 22% of deaths that would otherwise occur on U.S. roads without these technologies," according to a new report. Governmen... » read more

DAC/Semicon West Addresses Top Issues, Trends For Chips
By The SE Staff - 12 Jul, 2023 - Comments: 0

The Design Automation Conference (DAC) 2023 and Semicon West returned in full force this week, drawing in more attendees and sponsor companies than since before the pandemic. At times, booth traffic was four to five deep, blocking aisles, and standing room only was common at presentations. Hot topics included generative AI and the underlying semiconductor technology, data security, reliabili... » read more

Chip Industry’s Technical Paper Roundup: Mar. 28
By Linda Christensen - 28 Mar, 2023 - Comments: 0

New technical papers recently added to Semiconductor Engineering’s library: [table id=89 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us p... » read more

Interconnects: Exploring Semi-Metals (Penn State, IBM, Rice University)
By Technical Paper Link - 26 Mar, 2023 - Comments: 0

A technical paper titled "Exploring Topological Semi-Metals for Interconnects" was published by researchers at Penn State, IBM, and Rice University, with funding by Semiconductor Research Corporation (SRC). Abstract "The size of transistors has drastically reduced over the years. Interconnects have likewise also been scaled down. Today, conventional copper (Cu)-based interconnects face a ... » read more

Chip Industry’s Technical Paper Roundup: Jan. 31
By Linda Christensen - 31 Jan, 2023 - Comments: 0

New technical papers added to Semiconductor Engineering’s library. [table id=77 /] If you have research papers you are trying to promote, we will review them to see if they are a good fit for our global audience. At a minimum, papers need to be well researched and documented, relevant to the semiconductor ecosystem, and free of marketing bias. There is no cost involved for us posting l... » read more

3-Terminal Thermal Transistor With Thermal Measurements For The Switching And Amplification
By Technical Paper Link - 29 Jan, 2023 - Comments: 1

A technical paper titled "A three-terminal magnetic thermal transistor" was published my researchers at Rice University (Texas). Abstract "Three-terminal thermal analogies to electrical transistors have been proposed for use in thermal amplification, thermal switching, or thermal logic, but have not yet been demonstrated experimentally. Here, we design and fabricate a three-terminal magneti... » read more

Research Bits: Sept. 20
By Jesse Allen - 20 Sep, 2022 - Comments: 0

Multi-mode memristors Researchers from ETH Zurich, the University of Zurich, and Empa built a new memristor that can operate in multiple modes and could potentially be used to mimic neurons in more applications. “There are different operation modes for memristors, and it is advantageous to be able to use all these modes depending on an artificial neural network’s architecture,” said R... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 18 Mar, 2022 - Comments: 0

Chipmakers, OEMs Intel continues to build more fabs. First, the company announced fabs in Arizona and then Ohio. Now, Intel plans to invest up to €80 billion in the European Union over the next decade. As part of the effort, Intel plans to build two semiconductor fabs in Magdeburg, Germany. Construction is expected to begin in the first half of 2023 and production planned to come online in 2... » read more

Power/Performance Bits: Jan. 25
By Jesse Allen - 25 Jan, 2022 - Comments: 0

Nanoscale 3D optics Researchers at Rice University and University of Houston are using 3D printing to build nanostructures of silica for micro-scale electronic, mechanical, and photonic devices. “It’s very tough to make complicated, three-dimensional geometries with traditional photolithography techniques,” said Jun Lou, a professor of materials science and nanoengineering at Rice. �... » read more

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