tag: Rochester Institute of Technology

Technical Paper Round-up: May 3
By Linda Christensen - 03 May, 2022 - Comments: 0

New technical papers added to Semiconductor Engineering’s library this week. [table id=24 /] Semiconductor Engineering is in the process of building this library of research papers. Please send suggestions (via comments section below) for what else you’d like us to incorporate. If you have research papers you are trying to promote, we will review them to see if they are a good fit for... » read more

Hardware Encryption: Ultra-compact Active Interconnect Based on FeFET
By Technical Paper Link - 02 May, 2022 - Comments: 0

New technical paper "Hardware functional obfuscation with ferroelectric active interconnects" from researchers at Penn State, Rochester Institute of Technology, GlobalFoundries Fab1, North Dakota State University. Abstract "Existing circuit camouflaging techniques to prevent reverse engineering increase circuit-complexity with significant area, energy, and delay penalty. In this paper, we... » read more

FeFETs Bring Promise And Challenges
By Bryon Moyer - 17 Feb, 2021 - Comments: 3

Ferroelectric FETs (FeFETs) and memory (FeRAM) are generating high levels of interest in the research community. Based on a physical mechanism that hasn’t yet been commercially exploited, they join the other interesting new physics ideas that are in various stages of commercialization. “FeRAM is very promising, but it's like all promising memory technologies — it takes a while to get b... » read more

Week in Review: IoT, Security, Auto
By Jeff Dorsch - 21 Nov, 2018 - Comments: 0

Internet of Things Forrester Research released its 2019 Internet of Things predictions. Some key points: Bundled service offerings will catalyze a sleepy consumer IoT market; cybercriminals will lay siege to a smart-city implementation; and a market for IoT managed services will emerge in 2019. Black Friday and Cyber Monday are coming up. Those days present some opportunities to purchase ... » read more

Manufacturing Bits: March 27
By Mark LaPedus - 27 Mar, 2018 - Comments: 0

Nanostructure printers Using electron-beam lithography and reactive-ion etching techniques, Singapore’s Agency for Science, Technology and Research (A*STAR) has developed a new high-resolution color nanostructure printing system. The printer enables nanostructures made from silicon. It prints tiny structures with a wide range of colors. In the future, researchers hope that nanostructure ... » read more

The Week in Review: IoT
By Jeff Dorsch - 23 Feb, 2018 - Comments: 0

Finance Vectra raised $36 million in Series D funding led by Atlantic Bridge Capital. The Ireland Strategic Investment Fund and Nissho Electronics also participated in this funding round along with returning investors Khosla Ventures, Accel Partners, IA Ventures, AME Cloud Ventures, DAG Ventures, and Wipro Ventures, bringing Vectra’s total funding to date to $123 million. Vectra will use the... » read more

Power/Performance Bits: Oct. 31
By Jesse Allen - 31 Oct, 2017 - Comments: 0

Battery material supplies Researchers at MIT, the University of California at Berkeley, and the Rochester Institute of Technology conducted an analysis of whether there are enough raw materials to support increased lithium-ion battery production, expected to grow significantly due to electric vehicles and grid-connected battery systems. They conclude that while in the near future there shou... » read more

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