tag: Samsung

CXL Picks Up Steam In Data Centers
By Marie C. Baca - 26 Jan, 2023 - Comments: 0

CXL is gaining traction inside large data centers as a way of boosting utilization of different compute elements, such as memories and accelerators, while minimizing the need for additional racks of servers. But the standard is being extended and modified so quickly that it is difficult to keep up with all the changes, each of which needs to be verified and validated across a growing swath of h... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 20 Jan, 2023 - Comments: 0

Dutch tech industry group FME called for the European Commission to draft a position on whether and how to restrict computer chip technology exports to China, saying "more unified and powerful action" was needed from Europe, according to Reuters. Meanwhile, Dutch Prime Minister Mark Rutte said he saw gradual progress in talks with the U.S. over potential new restrictions on exporting chip-makin... » read more

The Path To Known Good Interconnects
By Laura Peters - 19 Jan, 2023 - Comments: 1

Chiplets and heterogenous integration (HI) provide a compelling way to continue delivering improvements in performance, power, area, and cost (PPAC) as Moore’s Law slows, but choosing the best way to connect these devices so they behave in consistent and predictable ways is becoming a challenge as the number of options continues to grow. More possibilities also bring more potential interac... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 13 Jan, 2023 - Comments: 0

Global semiconductor sales hit $45.5 billion during the month of November 2022, according to SIA’s January announcement. Year-over-year sales increased in November in the Americas (5.2%), Europe (4.5%), and Japan (1.2%), but decreased in Asia Pacific/rest of world (-13.9%) and China (-21.2%). Month-to-month sales were down across all regions. The United States, Mexico and Canada vowed to... » read more

Competing V2V Technologies Emerge, Create Confusion
By John Koon - 05 Jan, 2023 - Comments: 0

The battle over vehicle-to-vehicle communications technology has begun, as governments step back to see which of two main competing standards and lots of related technology are best suited for reducing accidents. V2V is an often-discussed wireless communication protocol that enables vehicles to communicate with each other, easing traffic congestion, avoiding accidents, and ultimately improvi... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 22 Dec, 2022 - Comments: 0

RISC-V The European Union said it will spend the equivalent of $286.5 million on a high performance computing ecosystem based on RISC-V. According to the call for proposals, the aim of the project is to “establish a partnership between the EuroHPC JU and a consortium of industry, research organizations and institutions in HPC to the development of innovative HPC hardware and software technol... » read more

Week In Review: Manufacturing, Test
By Karen Heyman - 09 Dec, 2022 - Comments: 2

The more than 1,400 attendees at this week’s IEDM, which celebrated the 75th anniversary of the transistor, were clearly focused on making the next 75 years of semiconductors even more remarkable than the last. Intel, Samsung, TSMC, STMicroelectronics, GlobalFoundries and imec announced breakthrough devices, materials, and even integration approaches. These included: Intel showcased adva... » read more

Blog Review: Dec. 7
By Jesse Allen - 07 Dec, 2022 - Comments: 0

Siemens EDA's Harry Foster looks at the continual maturing of FPGA functional verification processes through increasing adoption of various simulation-based and formal verification techniques. Synopsys' Stewart Williams introduces the Scalable Open Architecture for Embedded Edge (SOAFEE) project and how it can make automotive software development, testing, virtual prototyping, and validation... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 02 Dec, 2022 - Comments: 0

With the European Council’s adoption of its negotiating mandate for the European Chips Act, member states and the Czech Presidency of the Council have reached a critical milestone in supporting Europe’s efforts to advance manufacturing and supply of critical components, while bolstering R&D capacities for development of next-generation semiconductor innovations, according to SEMI. Ch... » read more

Challenges And Solutions In Chip Design
By Marc Swinnen - 21 Nov, 2022 - Comments: 0

Ansys is hosting IDEAS Digital Forum 2022, a no-cost virtual event that brings together industry executives and technical design experts to discuss the latest in EDA for Semiconductors, Electronics, and Photonics. The December 6th on-line event starts with Keynote addresses from Raja Koduri from Intel, Pankaj Kukkal from Qualcomm, and insights into the metaverse from DP Prakash with start-up... » read more

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