Designing Chips For Outer Space

By Ed Sperling - 08 Nov, 2023 - Comments: 0

If designing chips in cars sounds difficult, try designing them for space. There are huge temperature swings, and more radioactive particles than on Earth, which can cause single-event upsets, transients, functional interrupts, and latch-ups. A destructive latch-up can ruin a device, and in space that could transform an expensive piece of hardware into space junk. Ian Land, senior director for ... » read more

Satellites Bolster 5G Through Non-Terrestrial Networks

By Keysight - 11 Oct, 2023 - Comments: 0

The 3GPP plans to make 5G into a network that incorporates satellites to augment terrestrial 5G networks. These NTNs will extend the reach of 5G to regions lacking terrestrial infrastructure. Click here to read more. » read more

RT Kintex UltraScale FPGAs For Ultra High Throughput And High Bandwidth Applications

By Xilinx - 01 Dec, 2020 - Comments: 0

Xilinx's UltraScale architecture extends FPGA capability for space applications, delivering a step-function increase in I/O and memory bandwidth, capacity, performance, and in-orbit re-configurability. For the first time, the RT Kintex UltraScale XQRKU060 FPGA enables the satellite industry to access ultra-high throughput on-board processing of hundreds of Gb/s. This capability allows spacecraf... » read more

HDL Simulation Acceleration Solution For Microchip FPGA Designs

By Aldec - 23 Nov, 2020 - Comments: 0

Mission-critical FPGA designs for space and radar applications continue to increase in complexity, such that they require a comprehensive and robust verification environment. There are hardware-in-the-loop solutions in the market that utilize FPGA boards, but when it comes to establishing functional coverage and debugging the custom logic, users would typically need to go back to HDL simulation... » read more

Far Out AI In Remote Locations

By Susan Rambo - 08 Sep, 2020 - Comments: 0

There really isn’t anything that you can do on Earth with electronics that you can’t do in space, but it certainly can be a lot harder and take longer to fix is something goes wrong. And as more intelligent electronics are launched into space, the concern over potential failures is growing. AI inferencing has been pushing out further for some time, and it is starting to redefine what con... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 07 Aug, 2020 - Comments: 0

Pervasive computing — data center, edge, IoT Codasip and Metrics Design Automation announced they have integrated Metrics’ SystemVerilog RTL Simulation Platform within Codasip’s SweRV Core Support Package, version, and it will be accessible on the cloud. Aldec’s TySOM Embedded Development Kits have qualified for Amazon Web Services (AWS) IoT Greengrass. TySOM is a family of Xilinx Z... » read more

Case Study—RF ASIC Validation Of A Satellite Transceiver

By Adesto Technologies - 12 Jun, 2019 - Comments: 0

ASIC validation in the RF world comes with its own set of hurdles and challenges, with high-quality lab equipment, experience and know-how essential. A recently completed RF sub-system validation at S3 Semiconductors is presented in the form of a case study of the execution. The validation PCB design focussed on impedance matching and shielding RF signals from noise sources. We built up an effi... » read more

March’19 Startup Funding: Money Springs Forth

By Jeff Dorsch - 04 Apr, 2019 - Comments: 0

Another month, another couple of billion-dollar rounds. Singapore-based Grab raised nearly $1.5 billion from the SoftBank Vision Fund, bringing its total private funding to more than $4.5 billion and valuing the company at around $14 billion. Grab has acquired Uber’s ride-hailing business in Southeast Asia and now competes chiefly with Go-Jek of Indonesia in Thailand and other emerging mar... » read more

The Rising Need for Satellite Security

By Rambus - 05 Sep, 2018 - Comments: 0

Satellites today contain highly complex embedded microelectronics systems complete with processing, data storage, and data receiving/transmitting capabilities. Further, they are controlled by ground stations, computers in data centers. They are therefore susceptible to threats prevalent in cloud computing architectures including insider threats, malicious downloads, etc. As such, satellite secu... » read more

The Week In Review: IoT

By Jeff Dorsch - 11 Aug, 2017 - Comments: 0

Connectivity M1 Limited of Singapore worked with Nokia to launch a nationwide narrowband Internet of Things network, targeting such applications as asset tracking, environmental monitoring, fleet management, and smart energy management for buildings. M1 hopes to boost the IoT ecosystem in Singapore with the new NB-IoT network. M&A DuPont has agreed to acquire Granular, a provider of digita... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?