Making Chips To Last Their Expected Lifetimes


Chips are supposed to last their lifetime, but that expectation varies greatly depending upon the end market, whether the device is used for safety- or mission-critical applications, and even whether it can be easily replaced or remotely fixed. It also depends on how those chips are used, whether they are an essential part of a complex system, and whether the cost of continual monitoring and... » read more

Good Vs. Bad Acquisitions


M&A activity is beginning to heat up across the semiconductor industry, fueled by high market caps, low interest rates, and a slew of startups with innovative technology and limited market reach. Some of these deals are gigantic, such as the pending acquisition of Arm by Nvidia, and the proposed purchase of Maxim Integrated by Analog Devices. Others are more modest, such as Arteris IP's ... » read more

Chiplet Reliability Challenges Ahead


Assembling chips using LEGO-like hard IP is finally beginning to take root, more than two decades after it was first proposed, holding the promise of faster time to market with predictable results and higher yield. But as these systems of chips begin showing up in mission-critical and safety-critical applications, ensuring reliability is proving to be stubbornly difficult. The main driver fo... » read more

Speeding Up Process Optimization With Virtual Processing


Advanced CMOS scaling and new memory technologies have introduced increasingly complex structures into the device manufacturing process. For example, the increase in NAND memory layers has achieved greater vertical NAND scaling and higher memory density, but has led to challenges in high aspect ratio etch patterning and foot print scaling issues. Unique integration and patterning schemes have b... » read more

Scaling At The Angstrom Level


It now appears likely that 2nm will happen, and possibly the next node or two beyond that. What isn't clear is what those chips will be used for, by whom, and what they ultimately will look like. The uncertainty isn't about the technical challenges. The semiconductor industry understands the implications of every step of the manufacturing process down to the sub-nanometer level, including ho... » read more

Chiplet Momentum Rising


The chiplet model is gaining momentum as an alternative to developing monolithic ASIC designs, which are becoming more complex and expensive at each node. Several companies and industry groups are rallying around the chiplet model, including AMD, Intel and TSMC. In addition, there is a new U.S. Department of Defense (DoD) initiative. The goal is to speed up time to market and reduce the cost... » read more

EDA In The Cloud


Michael White, director of product marketing for Calibre physical verification at Mentor, a Siemens Business, looks at the growing compute requirements at 7, 5 and 3nm, why the cloud looks increasingly attractive from a security and capacity standpoint, and how the cloud as well as new lithography will affect the cost and complexity of developing new chips. » read more

More Knobs, Fewer Markers


The next big thing in chip design may be really big — the price tag. In the past, when things got smaller, so did the cost per transistor. Now they are getting more expensive to design and manufacture, and the cost per transistor is going up along with the number of transistors per area of die, and in many cases even the size of the die. That's not exactly a winning economic formula, which... » read more

New Packaging Roadmap


Historically, the electronics industry has drawn sharp distinctions between the integrated circuit chip, the package that protects it from the environment, and the board that connects it to other devices in a complete system. The circuit and systems worlds have been largely isolated from each other, using different tools, different processes, and different metrics for success. While integrated ... » read more

A New Playbook For The AI Era


It’s Q4 in Silicon Valley, which means that most tech enterprises are in strategic planning mode, taking stock of where they are today and charting a course for where they want to be over the next few years. This year’s Q4 planning cycle needs to be a little different: the opportunities before us are an order of magnitude larger. So are the challenges. To get to where we need to be, our... » read more

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