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Novel Reversible Chain Diagnosis Improves Resolution


Yield ramp for ICs designed on advanced process technologies faces new challenges because of the very complicated silicon defect types and defect distribution. Yield ramp and yield improvement are not just about profitability and time-to-market, but also have a role in today’s electronics supply chain crisis. That means yield ramp affects not just the IC maker, but the global economy. Ever... » read more

Making IC Test Faster And More Accessible: Part 2


Recently, my colleague Robert Ruiz described a new approach to scan test that utilizes the high-speed I/O (HSIO) ports that exist on most chips. The benefits of this new approach include reduced test time and cost thanks to the high-speed interface. Simplified pin electronics and tester setup are also benefits, as is the ability to run manufacturing tests in the field in support of silicon life... » read more

Scan Diagnosis


Jayant D’Souza, product manager at Mentor, a Siemens Business, explains the difference between scan test and scan diagnosis, what causes values in a scan test to change, how this can be used to hone in on the actual cause of a failure in a design, and how to utilize test hardware more efficiently. » read more

Scan Compression Is No Longer About Compression


Scan compression was introduced in the year 2000 and has seen rapid adoption. Nearly every design’s test methodology today implements this technology, which inserts compression logic in the scan path between the scan I/Os and the internal chains. In this article, we take a critical look at the technology to understand how scan compression has matured. The road to scan compression Since th... » read more