Monday At DAC 2018

By Brian Bailey - 26 Jun, 2018 - Comments: 0

DAC #55 started with rumors flying. Will this be the last DAC as we know it? Is there a huge chasm forming between academia and the industry? Will DAC be able to make it in Las Vegas where there is no local interest? Of course, those who have been in the industry know that this kind of speculation happens every few years, and in the 80s, Las Vegas was a very popular location for DAC. There was ... » read more

Quantum Computing Becoming Real

By Ed Sperling - 21 Jun, 2018 - Comments: 4

Quantum computing will begin rolling out in increasingly useful ways over the next few years, setting the stage for what ultimately could lead to a shakeup in high-performance computing and eventually in the cloud. Quantum computing has long been viewed as some futuristic research project with possible commercial applications. It typically needs to run at temperatures close to absolute zero,... » read more

IoT Wireless Battles Ahead

By Brian Bailey - 18 Jun, 2018 - Comments: 0

"The good thing about standards is that there are so many to choose from." – Andrew S. Tanebaum The extended version of that quote adds "furthermore, if you do not like any of them, you can just wait for next year's model." That could not be truer when it comes to IoT and wireless connectivity. Every standards group is rushing to create new versions of existing standards that use less p... » read more

CEO Outlook On Chip Industry (Part 3)

By Ed Sperling - 18 Jun, 2018 - Comments: 2

Semiconductor Engineering sat down with Wally Rhines, president and CEO of Mentor, a Siemens Business; Simon Segars, CEO of Arm; Grant Pierce, CEO of Sonics; and Dean Drako, CEO of IC Manage. What follows are excerpts of that conversation. To view part one, click here. Part two is here. L-R: Dean Drako, Grant Pierce, Wally Rhines, Simon Segars. Photo: Paul Cohen/ESD Alliance SE: Securit... » read more

Complexity, Reliability And Cost

By Ed Sperling - 14 Jun, 2018 - Comments: 0

Peter Schneider, director of Fraunhofer's Engineering of Adaptive Systems Division, sat down with Semiconductor Engineering to talk about future challenges in complexity, time to market and reliability issues, advanced packaging architectures, and the impact of billions of connected devices. What follows are excerpts of that discussion. SE: What is the biggest challenge you see in the semico... » read more

Seven Steps To Build A Successful IoT Solution

By Paul Williamson - 14 Jun, 2018 - Comments: 0

The technology sector is on course to produce a trillion connected IoT devices in the next two decades. As an innovator, you want to take advantage of this, but how and where do you begin navigating a complex world of hardware and software choices? The breadth of technology makes it easy for designers to build any kind of IoT solution at any scale across a continuum of applications. W... » read more

Farming Goes High-Tech

By Ann Mutschler - 13 Jun, 2018 - Comments: 0

Data from dirt — literally — is enabling farmers to perform detailed analysis to make their farming practices smarter, more efficient, and significantly more productive. Companies in every market are leveraging data to their business advantage, and the agricultural sector is no different. Even the venture capital community has taken note. According to ABI Research, some sizeable venture ... » read more

Right-Sized Security

By Paul Karazuba - 12 Jun, 2018 - Comments: 0

Security is a key design consideration of any connected product. Nefarious parties can and will attempt to exploit security flaws in order to capture sensitive data, gain device control, or for a myriad of other reasons. When considering security needs and implementation in their systems, Device OEMs must balance a number of factors. Security is obviously a very important factor; however, de... » read more

Toward IIoT Security Standards

By Kevin Fogarty - 07 Jun, 2018 - Comments: 0

Security is a high priority within Industrial IoT projects, but it is advancing like the rest of the industry—inconsistently, with big gaps between the leaders and everyone else. That isn't unique to one or two industrial segments. It applies to all of them, and even to slices within particularly industries. "There is some confusion about security because it's not just the IT issues," s... » read more

Real-Time Payments And How To Secure Them

By Rambus - 06 Jun, 2018 - Comments: 0

In today’s digital, on-demand world, we have instant access to information, products and services. Digitization and digitalization has driven this change, and we are now accustomed to almost instant payments via cards, web services and apps. The development of instantaneous payments between bank accounts is therefore a natural evolution. Download this eBook to: Learn how to combat fra... » read more

← Older posts Newer posts →

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?