Week In Review: Manufacturing, Test


Chipmakers, OEMs At Intel’s Architecture Day this week, the company revealed several new chip architectures. Some were already announced, while others are new. These include Intel’s first performance hybrid architecture, a data center architecture, a discrete gaming graphics processing unit (GPU) architecture, infrastructure processing units (IPUs), and a data center GPU architecture. Here... » read more

Week In Review: Auto, Security, Pervasive Computing


Security Infineon Technologies is coordinating a group of twelve partners, including researchers, electronics industry, and end users, who are working to find and fix IoT security flaws. The research project, called “Design methods and hardware/software co-verification for the unique identifiability of electronic components” falls under VE-VIDES, which is part of the Trustworthy Electronic... » read more

Blog Review: Aug. 18


Arm's Charlotte Christopherson explores the possibilities of flexible, non-silicon electronics with the creation of PlasticArm, an ultra-minimalist Cortex-M0-based SoC that, even with just 128 bytes of RAM and 456 bytes of ROM, is twelve times more complex than previous flexible electronics. Cadence's Claire Ying highlights the importance of integrity and data encryption (IDE) technology for... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive Infineon announced a new MEMS scanner chipset for automotive heads-up displays (HUD) and AR (augmented reality) eyeglasses. The design has MEMS mirror — which tilts and can work with laser beam scanner (LBS) projectors — and MEMS driver. The size and energy use is small and yet it projects content over a wider area of the windshield. A partnership between Ansys and IPG Automo... » read more

Blog Review: Aug. 11


Arm's Rahul Mathur finds that traditional interconnects have become a bottleneck for improving IC performance and suggests buried interconnects as a way to lower signal routing delay. Cadence's Paul McLellan checks out forksheet FETs, a new transistor type that could allow scaling past 3nm, and the interconnect advances that will need to accompany it. A Synopsys writer explains the new LP... » read more

Blog Review: Aug. 4


Cadence's Paul McLellan listens in as industry luminaries celebrate 50 years of the microprocessor with a discussion on major challenges to the growth of microprocessors, inflection points over the last 50 years, and predictions for the next 25. Siemens EDA's Vladimir Kirichenko warns that designing electrical and thermal systems separately may lead to various problems such as late design ch... » read more

Week In Review: Manufacturing, Test


Chipmakers Intel has outlined its new process technology roadmap with plans to regain the leadership position in the market. As part of the move, Intel has changed the way it designates the nodes, revealed its new gate-all-around (GAA) transistor, and disclosed a customer for the GAA technology--Qualcomm. And not to be outdone, Intel has broadened its packaging portfolio. Intel is changing ... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive SGS-TÜV Saar certified that Cadence’s Tensilica Xtensa processors with FlexLock meets the ISO 26262:2018 standard to ASIL-D level. The new FlexLock feature is key to the certification because it supports lockstep, a fault-tolerant method that runs the same operation on two cores at the same time and then compares the output. Any difference in the output can be examined for issues... » read more

Blog Review: July 28


Synopsys' Chris Clark considers potential vulnerabilities in automotive over-the-air updates and best practices and new standards the industry can implement to improve security of vehicle software updates. Cadence's Paul McLellan gets a look at expected new fab construction in the coming years and where capacity is being focused. Siemens' Robin Bornoff dives into electromagnetic simulatio... » read more

Chip Shortages Grow For Mature Nodes


The current wave of chip shortages is expected to last for the foreseeable future, particularly for a growing list of critical devices produced in mature process nodes. Chips manufactured at mature nodes typically fall under the radar, but they are used in nearly every electronic device, including appliances, cars, computers, displays, industrial equipment, smartphones, and TVs. Many of thes... » read more

← Older posts Newer posts →