Enabling Test Strategies For 2.5D, 3D Stacked ICs


Improved testability, coupled with more tests at more insertion points, are emerging as key strategies for creating reliable, heterogeneous 2.5D and 3D designs with sufficient yield.  Many changes need to fall into place to make side-by-side 2.5D and 3D stacking approaches cost-effective, particularly for companies looking to integrate chiplets from different vendors. Today, nearly all of t... » read more

The Drive Toward More Predictive Maintenance


Maintenance is a critical behind-the-scenes activity that keeps manufacturing facilities running and data centers humming. But when not performed in a timely manner, it can result in damaged products or equipment, or significant system/equipment downtime. By shifting from scheduled maintenance to predictive maintenance, factories and electronic system owners can reap substantial benefits, in... » read more

Blog Review: Sept. 7


Cadence's Paul McLellan shares highlights from the recent Hot Chips tutorial on CXL and how enhanced memory pooling enables new memory usage models as CXL 3.0 approaches the same speed as DRAM. Synopsys' Sam Tennent and Kamal Desai highlight the emergence of virtual prototyping, its synergy with continuous integration and development setups, and the benefits when these disciplines are combin... » read more

Week In Review: Manufacturing, Test


New fab construction At an event in Arizona, U.S. Commerce Secretary Gina Raimondo urged states to compete for funding made available for producing semiconductors by the U.S. federal government. Indeed, several companies are already doing just that. The latest developments include: Micron plans to invest approximately $15 billion through 2030 for a new memory fab near its existing headquart... » read more

Why Gas Sensing Is Becoming Localized


Sensors that measure air flow, air quality, and chemical makeup are being deployed increasingly for both indoor and outdoor environmental monitoring, in homes, automobiles, and industrial facilities. But despite a raft of new applications for these devices, the necessary standards needed to calibrate and compare those devices are trailing well behind rapid development of new types and combinati... » read more

Blog Review: Aug. 31


Cadence's Paul McLellan wonders what's happened to 450mm wafers as equipment development efforts end, the only wafer fab is decommissioned, and manufacturers see little likelihood to recoup further investment in R&D. Synopsys' Manuel Mota finds that the scale and modular flexibility of chiplets can help meet narrowing time-to-market windows and looks at how UCIe provides a complete stack... » read more

Week In Review: Auto, Security, Pervasive Computing


Automotive, mobility California will ban the sale of new gasoline vehicles so that by 2035 100% of new cars and light trucks sold in California will be zero-emission vehicles. NXP Semiconductors announced multi-year supply agreements for its S32 family. Agreements to supply the S32 domain and zonal automotive processors to OEMs will include upcoming 5nm ASIL-D processors. Keysight Techno... » read more

Blog Review: Aug. 24


Synopsys' Manuel Mota presents an overview of some of the newest multi-chip module packaging types and their advantages and disadvantages for different kinds of applications, as well as the importance of die-to-die interfaces. Cadence's Steve Brown finds that innovative products require that electronics be analyzed in the context of the environment in which they run, making mechanical and el... » read more

Fan-Out Packaging Gets Competitive


Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds, it creates lower thermal resistance, a slimmer package, and potentially lower costs. Yet, if the h... » read more

Collaborating To Decarbonize The Semiconductor Manufacturing Value Chain


By Mousumi Bhat and Peter Spiller SEMICON West 2022 Hybrid gathered experts from across the semiconductor industry for the debut Sustainability Summit to talk about the sustainability of the industry’s growth. Semiconductor chips have become ubiquitous in recent years. All aspects of society have become extremely dependent on semiconductors. The post-pandemic revenue growth of semicondu... » read more

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