tag: SEMI

Blog Review: Nov. 16
By Jesse Allen - 16 Nov, 2022 - Comments: 0

Siemens EDA's Jake Wiltgen explains the difference between transient and permanent faults when designing to the ISO 26262 standard, including where they come from and key ways to protect against them. Synopsys' Vikas Gautam points to how the economics of designing large SoCs is driving chiplet-based designs and the need for die-to-die standards such as UCIe, along with the key protocol verif... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 11 Nov, 2022 - Comments: 0

U.S. President Joe Biden appears ready to increase pressure on Japan and the Netherlands to help block the flow of advanced chip technology to China, where it can be used to develop cutting-edge weapons. "You will see Japan and Netherlands follow our lead," U.S. Commerce Secretary Gina Raimondo told CNBC. Japan plans to budget ¥350 billion ($2.38 billion) in a research collaboration with th... » read more

Blog Review: Nov. 9
By Jesse Allen - 09 Nov, 2022 - Comments: 0

Cadence's Claire Ying finds that the latest update to CXL, which introduced memory-centric fabric architectures and expanded capabilities for improving scale and optimizing resource utilization, could change how some of the world’s largest data centers and fastest supercomputers are built. Synopsys' Gervais Fong and Morten Christiansen examine the latest updates in the USB 80Gbps specifica... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 04 Nov, 2022 - Comments: 0

Nikkei Asia reports the U.S. is urging allies, including Japan, to restrict exports of advanced semiconductors and related technology to China. The U.S. holds 12% of the global semiconductor market, Japan has a 15% share, while Taiwan and South Korea each have about a 20% share. Some U.S. companies have called for other countries to adopt U.S.-style export curbs, arguing it is unfair for only A... » read more

Blog Review: Nov. 2
By Jesse Allen - 02 Nov, 2022 - Comments: 0

Siemens EDA's Harry Foster examines how successful FPGA projects are in terms of verification effectiveness, finding that only 16% of all FPGA projects were able to achieve no non-trivial bug escapes into production, worse than IC/ASIC in terms of first silicon success. Synopsys' Jamie Boote and The Chertoff Group's David London break down best practice guidance and directives U.S. governmen... » read more

Fabless IDMs Redefine The Leading Edge
By Marie C. Baca - 27 Oct, 2022 - Comments: 0

Large systems companies are looking more like integrated device manufacturers, designing their own advanced chips, packages, and systems for internal use. But because these are not pure-play chip companies, they are disrupting a 10-year cadence of customization and standardization that has defined the chip industry from its inception, and extending the period of innovation without the associate... » read more

Blog Review: Oct. 26
By Jesse Allen - 26 Oct, 2022 - Comments: 0

Synopsys' Teng-Kiat Lee and Sandeep Mehndiratta argue that IC design in the cloud can support an existing on-prem strategy, enable large and small enterprises to manage cost and capacity more effectively, and offer security for valuable semiconductor IP. Siemens EDA's Chris Spear finds that SystemVerilog classes are a good way to encapsulate both variables and the routines that operates on t... » read more

Week In Review: Semiconductor Manufacturing, Test
By Karen Heyman - 21 Oct, 2022 - Comments: 0

Fallout from the new U.S. export controls continues. Under new regulations, companies looking to supply Chinese chipmakers with advanced manufacturing equipment (<14nm) must first obtain a license from the U.S. Department of Commerce. In addition, U.S. persons (citizens and permanent residents) are barred from supporting China’s advanced chip development or production without a license. ... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 21 Oct, 2022 - Comments: 0

Tools and IP Electronic system design revenue hit a record $3.75 billion in the second quarter, according to a report from ESD Alliance, a SEMI Technology Community. That number represents a 17.5% year-over-year increase. Walden C. Rhines, the report’s executive sponsor, said it was the largest such jump in over a decade and that all product categories and geographic regions recorded second ... » read more

Additive Techniques For Flexible Hybrid Electronics Packaging And Integration With Human Body
By Gity Samadi - 20 Oct, 2022 - Comments: 0

By Gity Samadi and Paul Semenza Flexible hybrid electronics (FHE) has spawned the development of novel packaging techniques to overcome the application limitations of the rigid boards, high-temperature solders, bulky component packages, and insertion processes used in traditional printed circuit boards. Thin, flexible substrates, bare die, and combinations of printed and small-format package... » read more

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