tag: SEMI

Blog Review: March 17
By Jesse Allen - 17 Mar, 2021 - Comments: 0

Synopsys' Chris Clark considers the growing number of automotive sensors and the cost/performance tradeoffs between edge computing capability, sensor fusion, sensor degradation, monitoring, and the maintenance of the software over the lifespan of a vehicle. Cadence's Paul McLellan checks out how the process of loading the bootstrap into memory has changed over the years, from hand-entered on... » read more

Blog Review: March 10
By Jesse Allen - 10 Mar, 2021 - Comments: 0

Siemens EDA's Harry Foster checks out how the maturity of verification processes impact bug escapes in FPGA designs and whether safety critical development processes prevent bugs from escaping to silicon. Synopsys' Dennis Kengo Oka examines the weaknesses and vulnerabilities in automotive keyless entry systems and how security researchers hacked the Tesla Model X key fob. Cadence's Paul M... » read more

Blog Review: March 3
By Jesse Allen - 03 Mar, 2021 - Comments: 0

Siemens EDA's Ray Salemi considers incrementalism in engineering, the transition from drawing circuits to writing RTL, and the next big leap of using proxy-driven testbenches written in Python. Cadence's Shyam Sharma looks at key changes from LPDDR5 in the LPDDR5X SDRAM standard, which extends clock frequencies to include 937MHz and 1066MHz resulting in max data rates of 7500MT/s and 8533 MT... » read more

Predicting And Avoiding Failures In Automotive Chips
By Ed Sperling - 02 Mar, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss automotive electronics reliability with Jay Rathert, senior director of strategic collaborations at KLA; Dennis Ciplickas, vice president of advanced solutions at PDF Solutions; Uzi Baruch, vice president and general manager of the automotive business unit at OptimalPlus; Gal Carmel, general manager of proteanTecs' Automotive Division; Andre van de ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 26 Feb, 2021 - Comments: 0

Chipmakers and OEMs Several chipmakers have not resumed production in their fabs in Texas for the second consecutive week. This follows power outages due to a major winter storm. As reported, a severe winter storm hit many parts of the United States, including Texas. Last week, utility providers began to prioritize service to residential areas in Austin, Texas. As a result, electricity and ... » read more

Blog Review: Feb. 24
By Jesse Allen - 24 Feb, 2021 - Comments: 0

Siemens EDA's Harry Foster checks out the efficiency and effectiveness of verification on ASIC and IC designs with a look at how many projects meet the original schedule, the number of required spins, and classification of functional bugs. Cadence's Paul McLellan listens in as Philippe Magarshack of ST Microelectronics on how the company uses massive amounts of data generated by its fabs to ... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 19 Feb, 2021 - Comments: 0

Chipmakers and OEMs A severe winter storm has hit many parts of the United States, including Texas. In Austin, utility providers are prioritizing service to residential areas. As a result, electricity and natural gas providers have temporarily suspended service to Austin’s semiconductor manufacturers, including Samsung and NXP. "Due to the recent blackouts in Texas, Samsung Austin Semicon... » read more

More Silicon Wafer Consolidation
By Mark LaPedus - 18 Feb, 2021 - Comments: 0

The silicon wafer business typically flies under the radar, but it’s a fundamental part of the semiconductor business. Every chipmaker needs to buy silicon wafers in one size or another. In the supply chain, silicon wafer vendors produce and sell bare or raw silicon wafers to chipmakers, who in turn process them into chips. So it’s important to keep an eye on the market. Today, the s... » read more

China Passes Americas And Japan In IC Capacity
By Christian Dieseldorff - 18 Feb, 2021 - Comments: 0

Back in 2012, China ranked fifth among seven regions worldwide in IC wafer capacity but surged past the Americas and Japan in 2018 and 2019 to claim the number three position (figure 1). That’s a big deal given that ICs account for the largest share of wafer capacity excluding discrete, opto, MEMS and sensors. China’s IC wafer capacity growth accelerated to tune of 14% in 2019 and 21% in... » read more

Blog Review: Feb. 17
By Jesse Allen - 17 Feb, 2021 - Comments: 0

In a video, Synopsys' Tim Mackey warns that IoT device manufacturers are dealing with a serious challenge when it comes to security and points to the types of software threats that could impact IoT products. Siemens' Paul van Straten finds that the rise in vehicle complexity and intensified global competition means traditional automotive OEMs will need to explore new approaches to vehicle de... » read more

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