The Week In Review: Aug. 23

By Ed Sperling - 23 Aug, 2013 - Comments: 0

By Ed Sperling Cadence won a deal with Realtek, which licensed the Tensilica HiFi audio DSP core for voice recognition technology. Fast voice triggers have been possible for some time, but being able to combine that with low power for mobile devices isn’t easy because the devices are always on—or at least enough “on” to pick up voice commands. Mentor Graphics turned in a record-bre... » read more

450mm Is On Its Way!

By Adrienne Downey - 15 Aug, 2013 - Comments: 0

By Adrienne Downey Intel finally has taken the big plunge into 450mm manufacturing with the announcement of the start of construction of fab D1X Module 2. The company plans to spend $2 billion on construction of the new development fab this year alone. Its twin fab, Module 1, is 450mm-compatible, but will begin production later this year as a 300mm fab running a 14nm process technology. Intel�... » read more

Blog Review: Aug. 14

By Ed Sperling - 14 Aug, 2013 - Comments: 0

By Ed Sperling Synopsys’ Eric Huang unveils the fastest USB ever. The seat belt is extra. Mentor’s Nazita Saye sees the light—well, at least a refracted version of it—through the lens of a plastic bottle. This one is a real energy saver for the money, even if you have to forfeit the recycling fee. Check out the link. Cadence’s Brian Fuller takes a sledgehammer to the semicond... » read more

Blog Review: July 24

By Ed Sperling - 24 Jul, 2013 - Comments: 0

By Ed Sperling Mentor’s Harry Foster unleashes part six of the Wilson Research Group functional verification study, this segment digging deeper into the time spent in verification. The numbers have surpassed time spent on the design side, which either means the front-end tools are getting better or the verification problem is becoming more difficult. Cadence’s Brian Fuller interviews I... » read more

The Alphabet Soup Of New Material Science

By Joanne Itow - 18 Jul, 2013 - Comments: 0

By Joanne Itow Escaping the scorching Arizona temperatures is only one reason why I always look forward to Semicon West. This year’s event was packed with an exceptional variety of activities and vendors. What was the most memorable take-away from the show? There were plenty of panels, presentation and networking discussions on the 450mm wafer transition and EUV. But the biggest thing that I... » read more

The Rise Of Semiconductor IP Subsystems

By Various Writers - 11 Jul, 2013 - Comments: 0

The semiconductor IP (SIP) market arose when SIP vendors created IP functions that mirrored those found in the discrete semiconductor market and made those functions available to SoC designers in the form of hard or soft SIP blocks. As the SoC and SIP markets evolved, it was a natural evolution that many discrete SIP functions be converged into larger blocks that mimic system-level functions (i... » read more

The Stakes Are High

By Joanne Itow - 20 Jun, 2013 - Comments: 0

By Joanne Itow Whether you call it a transition or a transformation, evolutionary or revolutionary, the implementation of 450mm wafers is going to be disruptive. There are both technical and operational hurdles associated with semiconductor production on 450mm wafers. The ramp of 450mm is expected to change the semiconductor manufacturing landscape. And what about the changes that may occur ev... » read more

Painting By Numbers

By Joanne Itow - 16 May, 2013 - Comments: 0

By Joanne Itow Semiconductor revenue growth dropped to a compound annual growth rate of only 3.4% over the past five years and units grew only 3.0%. Throughout the same period, semiconductor wafer demand grew 6.6%, higher than unit growth but lower than the historical average. What caused this decline and will the industry ever get back to ‘normal’ growth rates? Figure 1. Annual Growth ... » read more

Fabs At Risk

By Adrienne Downey - 13 Apr, 2013 - Comments: 0

By Adrienne Downey There are hundreds of semiconductor fabs spread all over the world. The trend over the past several years has been one of consolidation into several main manufacturing centers in the Asia/Pacific region, the United States, and Europe. Unfortunately for the industry, many of these fabs are located in areas prone to earthquakes. Some locations are also at an added risk of dama... » read more

Programming The Future

By Joanne Itow - 21 Mar, 2013 - Comments: 0

By Joanne Itow After Achronix and Altera made significant announcements involving FPGA products and Intel’s advanced manufacturing technology, I decided to take a closer look at some of the market numbers involved. Just to recap, in February, Achronix announced the company began shipping the first FPGA device manufactured on Intel’s 22nm, Tri-Gate process technology. One week later, Altera... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

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