Week In Review: Semiconductor Manufacturing, Test

By Gregory Haley - 03 Mar, 2023 - Comments: 0

Semiconductor Research Corporation (SRC) released an interim roadmap for Microelectronic and Advanced Packaging Technologies (MPAT) that targets 10- to 15-year goals for 3D integration and multi-chiplet packaging. The roadmap is open for comments. Participants in the MPAT include AMD, IBM, Intel, Texas Instruments, Purdue University, SUNY Binghamton and the Georgia Institute of Technology. It i... » read more

Week In Review: Semiconductor Manufacturing, Test

By Karen Heyman - 03 Feb, 2023 - Comments: 0

Imec released its semiconductor roadmap, which calls for doubling compute power every six months to handle the data explosion and new data-intensive problems. Imec named five walls (scaling, memory, power, sustainability, cost) that need to be dismantled. The roadmap (below) stretches from 7nm to 0.2nm (2 angstroms) by 2036, and includes four generations of gate-all-around FETs followed by thre... » read more

Neuromorphic HW Fabric That Supports A Recently Proposed Class of Stochastic Neural Network

By Technical Paper Link - 25 May, 2022 - Comments: 0

New research paper titled "Neural sampling machine with stochastic synapse allows brain-like learning and inference" from University of Notre Dame and Department of Cognitive Sciences, University of California Irvine. Abstract "Many real-world mission-critical applications require continual online learning from noisy data and real-time decision making with a defined confidence level. Brain-... » read more

Week In Review: Auto, Security, Pervasive Computing

By Susan Rambo - 08 Apr, 2022 - Comments: 0

Automotive, mobility Qualcomm completed its acquisition of Arriver Business from SSW Partners. Arriver’s Driver Assistance, Computer Vision, and Drive Policy assets will become part of the Snapdragon Ride Platform. SSW Partners, a New York-based investment partnership, has acquired all shares in Veoneer, retaining its Tier-1 supplier and integrator businesses. Hyundai Motor Group gave Inf... » read more

The Chip Industry’s Next-Gen Roadmap

By Mark LaPedus - 21 Jan, 2021 - Comments: 1

Todd Younkin, the new president and chief executive of the Semiconductor Research Corp. (SRC), sat down with Semiconductor Engineering to talk about engineering careers, R&D trends and what’s ahead for chip technologies over the next decade. What follows are excerpts of that conversation. SE: As a U.S.-based chip consortium, what is SRC's charter? Younkin: The Semiconductor Research... » read more

System Bits: Jan. 16

By Ann Mutschler - 16 Jan, 2018 - Comments: 0

Nitrogen-atom-sized sensors A new quantum sensor developed by Fraunhofer researchers will be able to measure the tiny magnetic fields of the next generation of hard discs, leveraging the new opportunities that quantum technology promises. [caption id="attachment_430671" align="aligncenter" width="300"] The special ellipsoid form of the plasma reactor developed at Fraunhofer IAF allows for l... » read more

What’s Next For Transistors

By Mark LaPedus - 23 Jan, 2017 - Comments: 1

The IC industry is moving in several different directions at once. The largest chipmakers continue to march down process nodes with chip scaling, while others are moving towards various advanced packaging schemes. On top of that, post-CMOS devices, neuromorphic chips and quantum computing are all in the works. Semiconductor Engineering sat down to discuss these technologies with Marie Semeri... » read more

What’s Better than the Internet of Things?

By Jeff Dorsch - 01 Sep, 2016 - Comments: 0

We all like the Internet of Things, whatever that is. Would you be interested in the Innovative and Intelligent Internet of Things? The Semiconductor Research Corporation can get you involved in that project, also known as I3T. “This research enables breakthrough technologies for the next generation of intelligent, connected, and autonomous devices,” the I3T website reads. The program is... » read more

How Small Will Transistors Go?

By Mark LaPedus - 18 Aug, 2016 - Comments: 1

By Mark LaPedus & Ed Sperling There is nearly universal agreement that Moore’s Law is slowing down. But whether it will truly end, or just become too expensive and less relevant—and what will supplant device scaling—are the subject of some far-reaching research and much discussion. Semiconductor Engineering sat down with each of the leaders of three top research houses—[getent... » read more

Rethinking The Sensor

By Ed Sperling - 07 Jul, 2016 - Comments: 0

Sensor technology is beginning to change on a fundamental level as companies begin looking beyond a human’s five senses, on which early sensors were modeled, to what can be done with those sensors for specific applications. In some cases, [getkc id="187" kc_name="sensors"] don’t have to be as accurate as the sight, smell, touch, taste and hearing of a person. In others, they can be a... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: Semiconductor Research Corp.

Week In Review: Semiconductor Manufacturing, Test

Week In Review: Semiconductor Manufacturing, Test

Neuromorphic HW Fabric That Supports A Recently Proposed Class of Stochastic Neural Network

Week In Review: Auto, Security, Pervasive Computing

The Chip Industry’s Next-Gen Roadmap

System Bits: Jan. 16

What’s Next For Transistors

What’s Better than the Internet of Things?

How Small Will Transistors Go?

Rethinking The Sensor