Making Sensors More Reliable

By Karen Heyman - 05 Oct, 2023 - Comments: 0

Experts at the Table: Semiconductor Engineering sat down to talk about the latest issues in sensors with Prakash Madhvapathy, director of product marketing, Tensilica audio/voice DSPs group at Cadence; Kevin Hughes, senior product manager for MEMS sensors at Infineon; and Matthew Hogan, product management director at Siemens EDA. What follows are excerpts of that conversation. [L-R] Kevin ... » read more

Data Collection For Edge AI / Tiny ML With Sensors

By Renesas - 04 Oct, 2023 - Comments: 0

Reality AI software from Renesas provides solution suites and tools for R&D engineers who build products and internal solutions using sensors. Working with accelerometers, vibration, sound, electrical (current/voltage/ capacitance), radar, RF, proprietary sensors, and other types of sensor data, Reality AI software identifies signatures of events and conditions, correlates changes in signat... » read more

Network-on-Chips Enabling Artificial Intelligence/Machine Learning Everywhere

By Frank Schirrmeister - 28 Sep, 2023 - Comments: 0

Recently, I attended the AI HW Summit in Santa Clara and Autosens in Brussels. Artificial intelligence and machine learning (AI/ML) were critical themes for both events, albeit from different angles. While AI/ML as a buzzword is very popular these days in all its good and bad ways, in discussions with customers and prospects, it became clear that we need to be precise in defining what type of A... » read more

New Developments Set To Accelerate MIPI CSI-2 Adoption In Automotive

By Joseph Rodriguez - 14 Sep, 2023 - Comments: 0

As Advanced Driver-Assistance Systems (ADAS) become more sophisticated, cars are equipped with an increasing number of cameras and sensors. To support features like automated parking, adaptive cruise control, and enhanced night vision, sensors source multiple wavelengths and deploy cameras with higher quality data formats, higher frame and refresh rates. ADAS systems are all powered by data sou... » read more

Research Bits: August 22

By Jesse Allen - 22 Aug, 2023 - Comments: 0

Photonic memory Researchers from Zhejiang University, Westlake University, and the Chinese Academy of Sciences developed a 5-bit photonic memory capable of fast volatile modulation and proposed a solution for a nonvolatile photonic network supporting rapid training. This was made possible by integrating the low-loss phase-change material (PCM) antimonite (Sb2S3) into a silicon photonic plat... » read more

Nine Essential Criteria To Achieve A Successful Bonding Process

By Brewer Science - 14 Aug, 2023 - Comments: 0

A photosensitive permanent bonding material enables the creation of high-quality permanent bonds between dissimilar materials used in the creation of MEMS and sensors. Having a thorough understanding of the materials and product performance is crucial to the success of the end application. In this article, we explore nine criteria used to evaluate a polymeric photosensitive permanent bonding ma... » read more

Virtual Development Of Perception Sensor Systems

By Ron Martin - 10 Aug, 2023 - Comments: 0

By Ron Martin and Christoph Sohrmann Over the past few years, there has been a marked expansion in research and development activities related to driver assistance systems as well as highly automated and connected driving systems. However, this has yet to translate into a higher degree of automation in the average production vehicle – especially for SAE Level 3 and above. The next step in ... » read more

Automotive Lidar: Softening The Trade-off Between Ambiguity Range And Speed

By Technical Paper Link - 28 Jul, 2023 - Comments: 0

A technical paper titled “Overcoming the limitations of 3D sensors with wide field of view metasurface-enhanced scanning lidar” was published by researchers at Université Côte d’Azur and CRHEA. Abstract: "Lidar, a technology at the heart of autonomous driving and robotic mobility, performs 3D imaging of a complex scene by measuring the time of flight of returning light p... » read more

Research Bits: July 5

By Susan Rambo - 05 Jul, 2023 - Comments: 0

UTe2 breakthrough for quantum computing Scientists from the Macroscopic Quantum Matter Group laboratory at the University College Cork (UCC) in Ireland discovered a spatially modulating superconducting state in the superconductor uranium ditelluride (UTe2) that could be useful as in topological quantum computing. Using a powerful quantum microscope, the team found that the some of the electro... » read more

Demonstrating A Fully-2D-Material Based Device For Temperature Sensing In Cryogenic Regimes

By Technical Paper Link - 27 Jun, 2023 - Comments: 0

A technical paper titled “I-V-T Characteristics and Temperature Sensor Performance of a Fully-2D WSe2/MoS2 Heterojunction Diode at Cryogenic Temperatures” was published by researchers at Technische Universität Dresden, Institute of Ion Beam Physics and Materials Research, and National Institute for Materials Science. Abstract: "In this work, we demonstrate the usability of a fully-2D-mat... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?