Encapsulating Wearable Sensors Using A Pre-Mixed Two-Part Epoxy


By Anthony Buzzerio, Venkat Nandivada, and Rohit Ramnath The growing field of wearable medical technology relies heavily on miniaturized sensors capable of providing accurate and continuous physiological data. Ensuring the long-term reliability and performance of these sensors — often subjected to demanding conditions including physical stress, thermal fluctuations, and exposure to bodily ... » read more

Survey of DL-Based LiDAR Super-Resolution For Autonomous Driving (University College London)


University College London researchers published "A Comprehensive Survey on Deep Learning-Based LiDAR Super-Resolution for Autonomous Driving." Abstract "LiDAR sensors are often considered essential for autonomous driving, but high-resolution sensors remain expensive while affordable low-resolution sensors produce sparse point clouds that miss critical details. LiDAR super-resolution addre... » read more

Scaling Ultra-Low-Power Edge Intelligence For Smart Devices


For decades, the data collection pipeline for sensors has been the exact same—measure, transmit, and process elsewhere. While it’s been a failproof method all these years, it’s also resulted in a large amount of energy consumption, meaning your smart watch could have a longer battery life. Neuronova is aiming to change things up. The company’s goal? Empowering the next generation of ... » read more

Flexible ICs, MEMS, Metal Oxides Solve Fresh Problems


Key Takeaways: Flexible ICs are durable and form-fitting, but they add manufacturing challenges to already complex processes, while printed flex sensors lack infrastructure. MEMS are finding new popularity in massively parallel systems, on one device, or in many devices distributed across a network. Metal oxide-based sensors are more scalable than those relying on photonic crystals, ... » read more

Research Bits: Jan. 27


Analog in-memory compute Researchers from Politecnico di Milano, Peking University, and Hewlett Packard Labs developed a Closed-Loop In-Memory Computing (CL-IMC) chip to reduce data movement between memory and processor. The fully integrated analog accelerator uses two 64×64 arrays of programmable SRAM cells along with integrated components including operational amplifiers and analog-to-di... » read more

High-Throughput Image Sensors: Smart Testing Powers Progress


In the race to produce higher resolution image sensors—now pushing beyond 500 megapixels—the industry faces significant challenges. These sensors aren’t just capturing more pixels; they’re handling massive streams of data, validating intricate on-chip AI functions, and doing it all at breakneck speeds. For manufacturers, the challenge is as unforgiving as it is critical: test more compl... » read more

Environmental Sensors Catch More Data For A Greener World


Sensors to detect temperature, pressure, and gases, such as CO2, have been around for centuries. However, the latest devices can measure a growing list of substances and process the data in real-time. Likewise, single-use sensors to measure pH levels in water are well established, but the latest water sensors can be deployed all along the pipeline from source to processing to outlet or tap, sav... » read more

MIPI CSI-2 Provides The Backbone Of Automotive Sensor Networks


As the automotive sector accelerates toward higher levels of autonomy, the complexity and scale of sensor networks within vehicles are rapidly expanding. For semiconductor engineers, the challenge is not only to deliver high-performance silicon but also to ensure robust, scalable, and secure data transport across heterogeneous sensor arrays. The MIPI CSI-2 protocol has emerged as the de facto s... » read more

Research Bits: Dec. 8


Iron-on circuit Researchers from Virginia Tech developed iron-on electronic circuits that can be applied to clothing. The patch uses electrically conductive liquid metal and a heat-activated adhesive to bond to fabric when heated with a hot iron. “E-textiles and wearable electronics can enable diverse applications from health care and environmental monitoring to robotics and human-machine... » read more

Advanced Packaging: A Key Technology For The Next Generation Of Electronics


In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the focus is increasingly shifting to the system level: How can processor cores, memory, sensors, and wireless modules be integrated as efficiently, compactly, and powerfully as possible within a sing... » read more

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