MIPI CSI-2 Provides The Backbone Of Automotive Sensor Networks


As the automotive sector accelerates toward higher levels of autonomy, the complexity and scale of sensor networks within vehicles are rapidly expanding. For semiconductor engineers, the challenge is not only to deliver high-performance silicon but also to ensure robust, scalable, and secure data transport across heterogeneous sensor arrays. The MIPI CSI-2 protocol has emerged as the de facto s... » read more

Research Bits: Dec. 8


Iron-on circuit Researchers from Virginia Tech developed iron-on electronic circuits that can be applied to clothing. The patch uses electrically conductive liquid metal and a heat-activated adhesive to bond to fabric when heated with a hot iron. “E-textiles and wearable electronics can enable diverse applications from health care and environmental monitoring to robotics and human-machine... » read more

Advanced Packaging: A Key Technology For The Next Generation Of Electronics


In recent years, advanced packaging has become much more important. While semiconductor manufacturers used to focus primarily on miniaturization and increasing the performance of individual chips, the focus is increasingly shifting to the system level: How can processor cores, memory, sensors, and wireless modules be integrated as efficiently, compactly, and powerfully as possible within a sing... » read more

Why Anti-Tamper Sensors Matter: Delivering A Comprehensive Security Solution


If your device processes valuable data, controls a critical function, or connects to a wider network, it’s a target. Attackers don’t just try to break software; they increasingly physically tamper with hardware: probing, fault injecting, or opening enclosures to bypass protections and extract secrets. The consequences range from IP theft and fraud to orchestrated downtime across fleets ... » read more

Overview Of The End-to-End Autonomous Driving through V2X Challenge (Tsinghua, HK Univ., Stanford, TU Munich et al.)


A new technical paper titled "Research Challenges and Progress in the End-to-End V2X Cooperative Autonomous Driving Competition" was published by researchers at Tsinghua University, Hong Kong University, Stanford University, TU Munich, Imperial College of London et al. Abstract "With the rapid advancement of autonomous driving technology, vehicle-to-everything (V2X) communication has emerge... » read more

Unlocking The Potential Of Ultra-Wideband Radar Technology


Ultra-wideband (UWB) is a short-range wireless communication technology that was once intended for military applications. In 2002, the U.S. Federal Communications Commission (FCC) exempted its license and made it available for public use. Since then, UWB technology has evolved over time, transforming the way devices interact by offering secure ranging and precision sensing capabilities. With... » read more

Research Bits: June 24


In-sensor visual processing Researchers from the University of Massachusetts Amherst created silicon-based in-sensor visual processing arrays that can both capture and process visual data in the analog domain to reduce the latency between sensing and identification. The team created two integrated arrays of gate-tunable silicon photodetectors that share bipolar analog output and low-power o... » read more

Next Level Inductive Sensing For New Metallic, Waterproof And Robust HMI Touch Designs


The need for advanced and improved human machine interfaces (HMIs) is increasing due to increasing digitalization trends including Industry 4.0, the Internet of Things (IoT), the Artificial Intelligence of Things (AIoT), and more. At the same time, product designers use various HMI touch technologies to improve and differentiate their designs from competitors. Liquid tolerance and sleek metalli... » read more

New Package Solutions for Automotive Optical Sensors


This article introduces the development of a new optical ball grid array (OBGA) packaging platform designed for automotive applications, with a focus on platform development and compliance with the Automotive Electronics Council (AEC) AEC-Q100 Grade 2 reliability standard. The proposed packaging solution extends beyond traditional cavity OBGA packages, which have been primarily utilized for mic... » read more

Research Bits: May 20


Smart t-shirt with sound waves Researchers at ETH Zurich developed a smart textile that uses acoustic waves passed through glass fibers to measure touch, pressure, and movement. The researchers said that using acoustic waves rather than electronics makes measurements more precise with low power consumption and the textiles lighter, more breathable, and easier to wash. It also uses readily avai... » read more

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