Verification And Validation Of Automotive Safety Element Out Of Context

By Synopsys - 01 Jun, 2022 - Comments: 0

With the increased use of electronics and software in the automotive systems, there are strict requirements for complex functions to perform safely and avoid causing damages to life and property in case of a failure. With the technology getting more complex, there are increasing risks from systematic failures and random hardware failures that need to be considered within the scope of functional... » read more

Accelerating Automotive Safety Certification With ASIL Compliant Certified IP

By Pavithra Suriyanarayanan - 07 Apr, 2022 - Comments: 0

By Pavithra C. Suriyanarayanan and Srini Krishnaswami The autonomous vehicle market is growing at a tremendous rate and functional safety in conventional, hybrid, and electric automobiles plays a significant role in achieving the required certification. Auto makers must go through numerous government regulations that call for increased safety and reliability all the way down to the component... » read more

Distributed Development Of IP And SoC In Compliance With Automotive ISO 26262

By Synopsys - 24 Feb, 2021 - Comments: 0

Automotive functional safety System-on-Chips (SoCs) for Advanced Driver Assistance Systems (ADAS) contain several complex Intellectual Property (IP) cores. The IP cores are developed as a Safety Element out of Context (SEooC), meaning the context of the end application is not fully known at delivery time. In addition, IP development might be distributed across the globe. To reduce the risk of f... » read more

Learning ISO 26262 – 2nd Edition

By Kurt Shuler - 07 Dec, 2020 - Comments: 0

You might think that when you get into a debate with a customer or a supplier about the exact interpretation of some aspect of ISO 26262, all you have to do is go to the standard, look it up, and there’s the answer you all need, plain as day. That would be ideal but often doesn’t reflect reality. To realize why, you have to understand the background to the standard. A short ISO 26262 o... » read more

Accellera Tackles Functional Safety

By Paul McLellan - 06 Aug, 2020 - Comments: 0

During DAC, Accellera had a workshop about functional safety. In case you don't know, Accellera has a relatively new working group (WG) on Functional Safety. The chair is Cadence's Alessandra Nardi, who coincidentally also received the Marie Pistilli Award for Women in EDA during DAC (you can read more about that in my post Alessandra Nardi Receives Marie Pistilli Award for Women in EDA). But ... » read more

Using Automotive IP For Easier Integration Of Safety Into SoCs

By Shivakumar Chonnad - 09 Jan, 2020 - Comments: 0

By Shivakumar Chonnad and Vladimir Litovtchenko Today’s SoCs for automotive safety-related systems integrate numerous IP blocks. At the system level, the Hardware Software Interface (HSI) between these IP blocks needs to be verified in simulation and validated in prototype. However, the scaling of the scope and effort to verify or validate is not linear based on the growing complexity of S... » read more

Best Practices for Traceability of Functional Safety Requirements In Automotive IP & SoCs

By Synopsys - 25 Sep, 2019 - Comments: 0

Automotive functional safety systems continue to incorporate complex features to meet wide range of consumer demands. Developing functional safety systems, including all the components such as the system-on-chip (SoC) and IP, hinges on the ability to meet the stringent automotive functional safety requirements such as definition, implementation, verification, and validation. Functional safety S... » read more

How To Build An Automotive Chip

By Ann Mutschler - 07 Mar, 2019 - Comments: 0

The introduction of advanced electronics into automotive design is causing massive disruption in a supply chain that, until very recently, hummed along like a finely tuned sports car. The rapid push toward autonomous driving has changed everything. This year, Level 3 autonomy will begin hitting the streets, and behind the scenes, work is underway to design SoCs for Level 4. But how these chi... » read more

What Can Go Wrong In Automotive

By Ed Sperling - 06 Oct, 2016 - Comments: 1

Semiconductor Engineering sat down to discuss automotive engineering with Jinesh Jain, supervisor for advanced architectures in Ford’s Research and Innovation Center in Palo Alto; Raed Shatara, market development for automotive infotainment at [getentity id="22331" comment="STMicroelectronics"]; Joe Hupcey, verification product technologist at [getentity id="22017" e_name="Mentor Graphics"]; ... » read more

Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?