tag: Si2

The Week In Review: Feb. 25
By Ed Sperling - 25 Feb, 2013 - Comments: 0

By Mark LaPedus Is China set to bail out a U.S. government technology darling? Two Chinese automotive companies, Geely and Dongfeng Motor, are reported to have bid between $200 million and $350 million for a majority stake in Fisker, the maker of plug-in hybrid cars. If that happens Fisker—which has $192 million in U.S. federal government loan guarantees—could be headed to China, according... » read more

More Intelligent Standards
By Ed Sperling - 11 Oct, 2012 - Comments: 0

There is a lot of talk these days about holistic power intent. The terminology may sound new, but the underpinnings are not. This was the idea behind the Common Power Format, which was proposed by Cadence back in 2006, and the Unified Power Format (more recently known as IEEE 1801), which was introduced the following year. These ideas were forward-looking at the time. They grasped the growi... » read more

3D Standards For The Real World
By Ed Sperling - 23 Feb, 2012 - Comments: 0

By Pallab Chatterjee Stacking die has progressed from what is technologically possible to what will be realistically feasible in a fabless or fab-lite world. The big challenges may be less about how to deal with stress caused by a TSV or thermal density and more about companies working together in a disaggregated supply chain. This was quite evident at a recent DesignCon panel dicussion on ... » read more

Too Many Standards, But Still Not Enough
By Ed Sperling - 15 Dec, 2011 - Comments: 0

By Ed Sperling The semiconductor industry has been one of the most prolific sectors in history when it comes to generating standards. Talk to any design engineer facing time-to-market pressures, new packaging approaches, and a mindboggling number of merchant IP, subsystems and interface requirements, and you’ll hear a compelling pitch for new standards. Talk to his or her boss and you’ll p... » read more

Build It Faster
By Ed Sperling - 17 Nov, 2011 - Comments: 0

By Ed Sperling Hitting market windows with IC designs has always been a struggle, but the race to the finish line is becoming more critical—and much more difficult. The reason: Market windows themselves are shrinking. Products that used to stick around for years may now only last for months, replaced by newer versions that offer either better performance or lower power. In many cases, par... » read more

Blog Review: July 20
By Ed Sperling - 20 Jul, 2011 - Comments: 0

By Ed Sperling Synopsys’ Eric Huang pays a visit to the Microsoft Store and finds a really smart salesperson who seems to know just about everything there is to know about the products for sale. And yes, that is somewhat unexpected. Cadence’s Jean-Michel Fernandez talks about creating SystemC peripheral models. Fernandez represents Cadence’s Team ESL, which is an interesting developme... » read more

Blog Review: May 25
By Ed Sperling - 25 May, 2011 - Comments: 0

By Ed Sperling Cadence’s Richard Goering follows Jim Hogan’s talk about the democratization of MEMS. This market is showing big gains lately, but to really release the emergency brake will require a different design approach. Mentor’s Robin Bornoff revs up the engine and turns on the neon underbody lighting in this look at the overclocking market, shifting effortlessly from cars to PC... » read more

Standards Update
By Ann Mutschler - 18 Nov, 2010 - Comments: 0

By Ann Steffora Mutschler In the sometimes-murky waters of system-level modeling standards where real-world adoption can be difficult to track, work is progressing to help hardware and software engineers realize the promise of true hardware-software codesign. The three main standards efforts related to modeling at the system level are OSCI’s TLM-2.0, OCP-IP’s OCP and Open Modeling TAB a... » read more

Building Up In 3D
By Ed Sperling - 18 Nov, 2010 - Comments: 0

By Ed Sperling Stacked die are expected to begin showing up in volume in late 2012 and in 2013, turning what has been a science experiment into a mainstream way of designing and manufacturing SoCs. This magnitude of this shift cannot be overstated, and clearly all of the pieces are not in place to make it all happen immediately. There also are significant technology challenges to overcome, ... » read more

Power Trip Advisor
By Ed Sperling - 12 Nov, 2009 - Comments: 0

By Geoffrey James There’s never been a greater demand for power-efficient silicon. As consumer electronic devices get smaller, with increased functionality, battery power becomes a premium resource. At the same time, “Green IT” is a major corporate trend, and the best way to be environmentally sensitive (while saving on energy costs) is to buy technology that ekes the maximum computing o... » read more

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