tag: Siemens EDA

Executive Outlook: Chiplets, 3D-ICs, and AI
By Ed Sperling - 29 May, 2025 - Comments: 0

Semiconductor Engineering sat down to discuss chiplets and the challenges of moving to 3D-ICs with Bill Mullen, Ansys fellow; John Ferguson, senior director of product management at Siemens EDA; Chris Mueth, senior director of new markets and strategic initiatives at Keysight; Albert Zeng, senior engineering group director at Cadence; Anand Thiruvengadam, senior director and head of AI product ... » read more

Thermo-Mechanical Stress On Active Chiplets In A 3D-IC Heterogeneous Package Assembly
By Siemens EDA - 29 May, 2025 - Comments: 0

The move to heterogeneous multi-chip/chiplet products improves yield, performance and modularity while reducing power and overall product footprint. However, this shift to heterogeneous assembly also introduces new complexities that can influence chip warpage and circuit behavior due to thermo-mechanical stress impacts. In heterogeneous 3D IC architectures, the interaction between the chips ... » read more

Blog Review: May 28
By Jesse Allen - 28 May, 2025 - Comments: 0

Siemens’ Patrick Hope considers how to fully perform post-route signal integrity verification on PCB designs while maintaining the project’s timeline by implementing a progressive verification methodology that enables signal integrity experts to focus on issues that demand their expertise rather than simple errors. Cadence’s Vanessa Do checks out how CXL addresses the constant demand f... » read more

Future-proofing AI Models
By Ann Mutschler - 21 May, 2025 - Comments: 0

Experts At The Table: Making sure AI accelerators can be updated for future requirements is becoming essential due to the rapid introduction of new models. Semiconductor Engineering sat down to discuss the challenges of future-proofing these designs with Marc Meunier, director of ecosystem development at Arm; Jason Lawley, director of product marketing for AI IP at Cadence; Paul Karazuba, vic... » read more

Blog Review: May 21
By Jesse Allen - 21 May, 2025 - Comments: 0

Synopsys’ Frank Malloy listens in on a panel discussing the engineering challenges introduced by multi-die designs, from multi-physics interactions that impact power and thermal integrity to the availability of multi-die packages and industry standards. Siemens’ Bruce Caryl shows how to determine how much a design’s power delivery network is contributing to jitter on the output drivers... » read more

Chip Industry Week in Review
By The SE Staff - 16 May, 2025 - Comments: 0

Check out the Inside Chips podcast for our behind-the-scenes analysis. Newly proposed U.S. legislation called the Chip Security Act would use location verification tracking as a tool to help combat chip smuggling. This follows a report by the Economist that showed Taiwan exports of advanced chips to Malaysia in the first quarter has nearly reached 2024 totals, heightening concerns that China... » read more

Intent Meets Implementation
By Siemens EDA - 15 May, 2025 - Comments: 0

Power efficiency has become a must-have in today’s ASIC and SoC designs. It’s no longer just about squeezing out more performance. It’s about doing so without draining the battery, wasting energy or overheating the system. Whether the chip is headed for a smartphone, a server rack in an AI datacenter or the control system of an autonomous vehicle, managing power wisely is as critical as m... » read more

Best Practices For Power-Aware Verification: Because Designing For Low Power Is Only Half The Battle
By Chandu Challapalli - 15 May, 2025 - Comments: 0

As modern chips push the limits of power efficiency, power management has become a top priority. With today’s increasingly complex devices, verifying power intent isn’t just a technical requirement. It’s a necessity for building reliable silicon. One of the most important lessons learned in recent years is that RTL and power intent must evolve together. Treating power intent as a post... » read more

Die-to-die Interconnect Standards In Flux
By Bryon Moyer - 15 May, 2025 - Comments: 0

UCIe, a standard for die-to-die interconnect in advanced packages, has drawn concern about being too heavyweight with its 2.0 release. But the fact that many of the new features are optional seems to have been lost in much of the public discussion. In fact, new capabilities that support a possible future chiplet marketplace are not required for designs that don’t target that marketplace. ... » read more

Development Flows For Chiplets
By Brian Bailey - 15 May, 2025 - Comments: 2

Chiplets offer a huge leap in semiconductor functionality and productivity, just like soft IP did 40 years ago, but a lot has to come together before that becomes reality. It takes an ecosystem, which is currently very rudimentary. Today, many companies have hit the reticle limit and are forced to move to multi-die solutions, but that does not create a plug-and-play chiplet market. These ear... » read more

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