How To Justify A Data Center

By Ann Mutschler - 24 Mar, 2022 - Comments: 0

The breadth of cloud capabilities and improvements in cost and licensing structures is prompting chipmakers to consider offloading at least some of their design work into the cloud. Cloud is a viable business today for semiconductor design. Over the past decade, the interest in moving to cloud computing has grown from an idea that was fun to talk about — but which no one was serious about ... » read more

The Value Of RF Harmonic Balance Analyses For Analog Verification

By Pradeep Thiagarajan - 24 Mar, 2022 - Comments: 0

By Pradeep Thiagarajan and Scott Guyton The world we live in is intricately connected by electronic systems that are expected to function flawlessly to satisfy consumer needs. Functionality violations beyond certain tolerance levels are frowned upon and negatively impact the quality level of products. These systems are required to function accurately, in tandem with other interdependent syst... » read more

Siemens EDA’s Full-Flow Portfolio Helps Engineers Achieve Optimum IC Design Verification Efficiency

By Siemens EDA - 24 Mar, 2022 - Comments: 0

A quick overview of the front-end flow using the S-Edit schematic capture environment will be covered in this white paper, followed by a more detailed description and steps for using the Analog FastSPICE (AFS) platform simulator to go through the verification of a basic amplifier design. Greater efficiency in analog design verification can now be achieved using our enhanced inter-tool commun... » read more

CXL and OMI: Competing or Complementary?

By Bryon Moyer - 23 Mar, 2022 - Comments: 1

System designers are looking at any ideas they can find to increase memory bandwidth and capacity, focusing on everything from improvements in memory to new types of memory. But higher-level architectural changes can help to fulfill both needs, even as memory types are abstracted away from CPUs. Two new protocols are helping to make this possible, CXL and OMI. But there is a looming question... » read more

Survey: 2022 Deep Learning Applications

By eBeam Initiative - 16 Mar, 2022 - Comments: 0

The 2022 member list of deep learning projects and products that eBeam members are working on in photomask to wafer semiconductor manufacturing. Participating companies include Advantest, ASML, Canon, CEA-LETI, D2S, Fraunhofer IPMS, Hitachi High-Tech Corporation, imec, NuFlare Technology, Siemens Industries Software, Inc.; Siemens EDA, STMicroelectronics, and TASMIT. Click here to see the su... » read more

Fundamental Shifts In IC Manufacturing Processes

By Ed Sperling - 14 Mar, 2022 - Comments: 2

High chip value and 3D packaging are changing where and how tests are performed, tightening design-for-reliability and accelerating the shift of tools from lab to fab. Heterogeneous integration and more domain-specific designs are causing a string of disruptions for chip manufacturers, up-ending proven fab processes and methodologies, extending the time it takes to manufacture a chip, and ul... » read more

Shifting The Design Paradigm To Improve Verification Efficiency

By Harry Foster - 10 Mar, 2022 - Comments: 0

We are in the midst of a verification crisis manifested by a growing gap between verification efficiency and effectiveness. This crisis cannot be solved through improvements in verification methodologies and techniques alone. Indeed, it requires a philosophical change in the way we approach design, with an emphasis on bug prevention. We refer to this fundamental change as design using intent-fo... » read more

Power Now First-Order Concern In More Markets

By Ann Mutschler - 10 Mar, 2022 - Comments: 0

Concerns about energy and power efficiency are becoming as important as performance in markets where traditionally there has been a significant gap, setting the stage for significant shifts in both chip architectures and in how those ICs are designed in the first place. This shift can be seen in a growing number of applications and vertical segments. It includes mobile devices, where batteri... » read more

Why Comparing Processors Is So Difficult

By Brian Bailey - 10 Mar, 2022 - Comments: 2

Every new processor claims to be the fastest, the cheapest, or the most power frugal, but how those claims are measured and the supporting information can range from very useful to irrelevant. The chip industry is struggling far more than in the past to provide informative metrics. Twenty years ago, it was relatively easy to measure processor performance. It was a combination of the rate at ... » read more

Robots Become More Useful In Factories

By John Koon - 10 Mar, 2022 - Comments: 0

Most people associate factory automation with large robotic machines, such as those that weld automobile chassis on assembly lines. But as prices drop and technology improves, robots are being deployed for smaller and more varied tasks, and they are getting better at all of them. Inside of factories, robots can significantly improve output, consistency, and reliability. They can work around ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?