tag: Siemens

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 21 Oct, 2022 - Comments: 0

Automotive, mobility The BMW Group will invest $1.7 billion in its U.S. operations to build electric vehicles and batteries, mostly in South Carolina. BMW will drop $1 billion in its South Carolina plant for EV production and $700 million for a new battery-assembly facility in the state. BMW also agreed to purchase battery cells from Japan-based Envision AESC, which plans to construct a new ba... » read more

Week In Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 14 Oct, 2022 - Comments: 0

Automotive, Mobility Hyundai announced all of its vehicles will be software-defined vehicles (SDVs) by 2025. The company said all newly launched Hyundai vehicles will be able to receive over-the-air software updates next year, and that it expects to register 20 million vehicles to its Connected Car Services system by 2025. Hyundai also said it will invest the equivalent of more than $12 billio... » read more

Foundational Changes In Chip Architectures
By Brian Bailey - 13 Oct, 2022 - Comments: 5

We take many things in the semiconductor world for granted, but what if some of the decisions made decades ago are no longer viable or optimal? We saw a small example with finFETs, where the planar transistor would no longer scale. Today we are facing several bigger disruptions that will have much larger ripple effects. Technology often progresses in a linear fashion. Each step provides incr... » read more

Week in Review: Design, Low Power
By Marie C. Baca - 07 Oct, 2022 - Comments: 0

Could power beams be the key to smart city infrastructure and 5G/6G connectivity? A new report says both lasers and microwaves offer possible paths forward in this area, though both technologies come with benefits and drawbacks. Diminishing returns from process scaling, coupled with pervasive connectedness and an exponential increase in data, are driving broad changes in how chips are desi... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 07 Oct, 2022 - Comments: 0

Automotive, mobility Infineon opened a new factory in Cegléd, Hungary, for assembly and test of high-power semiconductor modules for EVs. “The new manufacturing capacities will help Infineon accommodate the growing demand for electromobility applications,” said Infineon’s COO Rutger Wijburg in a press release. Production ramp-up started in February 2022. Infineon also announced it will ... » read more

EVs Raise Energy, Power, And Thermal IC Design Challenges
By Ann Mutschler - 06 Oct, 2022 - Comments: 0

The transition to electric vehicles is putting pressure on power grids to produce more energy and on vehicles to use that energy much more efficiently, creating a gargantuan set of challenges that will affect every segment of the automotive world, the infrastructure that supports it, and the chips that are required to make all of this work. From a semiconductor standpoint, improvements in th... » read more

Streamline DO-254 Compliance With Model-Based Design
By Jacob Wiltgen - 06 Oct, 2022 - Comments: 0

By Eric Cigan, MathWorks, and Jacob Wiltgen, Siemens EDA The purpose of DO-254 (formally known as RTCA/ DO-254 or ED80) is to provide guidance for the development of airborne electronic hardware. The Federal Aviation Administration (FAA), European Aviation Safety Agency (EASA), and other worldwide aviation safety authorities require this standard to ensure that complex electronic hardware us... » read more

Blog Review: Oct. 5
By Jesse Allen - 05 Oct, 2022 - Comments: 0

Arm's Andrew Pickard chats with Georgia Tech's Azad Naeemi and Da Eun Shim about an effort to evaluate the benefit of new interconnect materials and wire geometry and determine their impacts at the microprocessor level. Synopsys' Shekhar Kapoor shares highlights from a recent panel exploring the promises, challenges, and realities of 3D IC technology, including the potential of 3D nanosystem... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 30 Sep, 2022 - Comments: 0

Tools and IP Renesas introduced a new microprocessor that enables artificial intelligence to process image data from multiple cameras. "One of the challenges for embedded systems developers who want to implement machine learning is to keep up with the latest AI models that are constantly evolving,” said Shigeki Kato, Vice President of Renesas' Enterprise Infrastructure Business Division. �... » read more

Blog Review: Sept. 28
By Jesse Allen - 28 Sep, 2022 - Comments: 0

Cadence's Paul McLellan shares more highlights from the recent Hot Chips, including some very large chips and accelerators for AI and deep learning, new networks and switches, and mobile and edge processors. Synopsys' Marc Serughetti considers the different use cases for digital twins in automotive and how they can help determine the impact of software on verification, test, and validation a... » read more

← Older posts Newer posts →

  • Sponsors

About

Navigation

Connect With Us

Copyright ©2013-2024 SMG   |  Terms of Service  |  Privacy Policy