tag: Siemens

Costs of Static HW Partitioning on RISC-V
By Technical Paper Link - 25 Aug, 2022 - Comments: 0

A new technical paper titled "Static Hardware Partitioning on RISC-V -- Shortcomings, Limitations, and Prospects" was published by researchers at Technical University of Applied Sciences (Regensburg, Germany) and Siemens AG (Corporate Research). Abstract "On embedded processors that are increasingly equipped with multiple CPU cores, static hardware partitioning is an established means of c... » read more

Blog Review: Aug. 24
By Jesse Allen - 24 Aug, 2022 - Comments: 0

Synopsys' Manuel Mota presents an overview of some of the newest multi-chip module packaging types and their advantages and disadvantages for different kinds of applications, as well as the importance of die-to-die interfaces. Cadence's Steve Brown finds that innovative products require that electronics be analyzed in the context of the environment in which they run, making mechanical and el... » read more

Fan-Out Packaging Gets Competitive
By Laura Peters - 18 Aug, 2022 - Comments: 0

Fan-out wafer-level packaging (FOWLP) is a key enabler in the industry shift from transistor scaling to system scaling and integration. The design fans out the chip interconnects through a redistribution layer instead of a substrate. Compared to flip-chip ball grid array (FCBGA) or wire bonds, it creates lower thermal resistance, a slimmer package, and potentially lower costs. Yet, if the h... » read more

Blog Review: Aug. 17
By Jesse Allen - 17 Aug, 2022 - Comments: 0

Synopsys' Steve Pateras explains the basics of silicon lifecycle management and how it can help monitor, analyze, and optimize both semiconductor and end-user systems throughout the product value chain, from design and manufacturing to testing and maintenance. Siemens' Heather George considers the current state of 3D chiplet-based designs and efforts to standardize chiplet models and deliver... » read more

Week in Review: Auto, Security, Pervasive Computing
By Marie C. Baca - 12 Aug, 2022 - Comments: 0

Automotive and Mobility Search engine giant Baidu said Monday it is the first company to secure permits to operate robotaxis in China without a human safety driver. Baidu’s Apollo and Toyota-backed Pony.ai already operate robotaxis with backup drivers in Beijing. Also this week, smartphone maker Xiaomi said it is running autonomous driving tests on 140 vehicles in China. Xiaomi announced it ... » read more

Design And Security Challenges for VR
By John Koon - 10 Aug, 2022 - Comments: 0

Virtual reality is no longer just for gamers, and as this technology is deployed in everything from health care to industrial training, the requirements for processing more data faster over a high-speed connection are growing. Designing these devices continues to be a study in contradictions. They must be extremely low power, with a small enough batteries to make them comfortable to wear. Bu... » read more

Where Are The Autonomous Cars?
By Marie C. Baca - 08 Aug, 2022 - Comments: 0

Are we there yet? Governments, consumers, and engineers alike want to know how close the automotive world is to producing a fully autonomous Level 5 vehicle. While some experts say such vehicles could hit the road in the next few years, they're a shrinking minority. Most forecasts say a truly self-driving car is at least a decade away — and maybe much longer, because it requires disruptive... » read more

Week In Review: Design, Low Power
By Marie C. Baca - 05 Aug, 2022 - Comments: 0

Quantum Computing Researchers in China are putting a damper on Google’s claims of achieving quantum supremacy after they were able to use normal processors to complete a difficult calculation in a few hours. Sycamore, Google’s quantum computer, completed the same calculation in a few minutes back in 2019, but the company said it would take a supercomputer more than 10,000 years to do the... » read more

Cities Strive For More Smarts, Security
By SE Staff - 04 Aug, 2022 - Comments: 0

As cities around the world move beyond their first completed smart city projects and add more systems, they face hurdles in expanding but have more standards, technical resources, and real-world examples to draw on when making project design decisions. The main concern is keeping the smart city systems and their data and functions safe, especially if the system is touching critical infrastructu... » read more

Blog Review: July 27
By Jesse Allen - 27 Jul, 2022 - Comments: 0

Siemens' Keith Felton expects a greater emphasis on several areas of semiconductor package design next year, including accelerated growth of heterogeneous integration, multiple die, and chiplet SiPs, emergence and adoption of organic-based interposers, and early detection of thermal and electromechanical issues. Cadence's Paul McLellan visits Imec to find out about getting the heat out of 3D... » read more

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