tag: Siemens

Low-Power Analog
By Brian Bailey - 14 May, 2020 - Comments: 3

Analog circuitry is usually a small part of a large SoC, but it does not scale in the same way as digital circuitry under Moore's Law. The power consumed by analog is becoming an increasing concern, especially for battery-operated devices. At the same time, little automation is available to help analog designers reduce consumption. "Newer consumer devices, like smartphones and wearables, alo... » read more

Auto Power Becoming Much More Complex
By Bryon Moyer - 14 May, 2020 - Comments: 0

Rising electronics content in automobiles is putting increased focus on automotive power delivery networks (PDNs). Safety implications mean that thorough power design and verification, along with novel power isolation techniques, are needed at the vehicle level, involving both electrical and mechanical considerations. The electronic takeover can be measured by the percentage that electronic ... » read more

‘More Than Moore’ Reality Check
By Ann Mutschler - 14 May, 2020 - Comments: 1

The semiconductor industry is embracing multi-die packages as feature scaling hits the limits of physics, but how to get there with the least amount of pain and at the lowest cost is a work in progress. Gaps remain in tooling and methodologies, interconnect standards are still being developed, and there are so many implementations of packaging that the number of choices is often overwhelming. ... » read more

UPF 1.0, UPF 2.0, UPF 2.1, UPF 3.0, And Now UPF 3.1
By Mentor, a Siemens Business - 13 May, 2020 - Comments: 0

UPF is the fastest evolving IEEE standard, and UPF 3.1 is a major milestone in its evolution. This paper provides an in-depth analysis and relevant examples of all the new features introduced in UPF 3.1 along with semantic differences with earlier versions. It also highlights migration challenges to help users migrate from existing power formats to UPF 3.1. To read more, click here. » read more

Blog Review: May 13
By Jesse Allen - 13 May, 2020 - Comments: 0

Mentor's Neil Johnson considers when in a project certain verification methods should be deployed and the relative impact of techniques at a given point in subsystem design. Cadence's Paul McLellan looks back at the development of mobile standards with 2G, GSM, and the transition to all-digital transmission. Synopsys' Taylor Armerding highlights five online courses to boost your software ... » read more

Sensing Automotive IC Failures
By Anne Meixner - 12 May, 2020 - Comments: 1

The sooner you detect a failure in any electronic system, the sooner you can act. Together, data analytics and on-chip sensors are poised to boost quality in auto chips and add a growing level of predictive maintenance for vehicles. The ballooning number of chips cars makes it difficult to reach 10 defective parts per billion for every IC that goes into a car.  And requiring that for a 15-y... » read more

Simulation-driven EV Battery Pack Design And Manufacturing In The Decade Of Vehicle Electrification
By Puneet Sinha - 07 May, 2020 - Comments: 0

In the last decade, the electric vehicle (EV) industry has grown tremendously from just few offerings to today, when every automaker is working to electrify its vehicle portfolio. A lion’s share of this growth can be attributed to the advancements in lithium-ion (Li-ion) battery technology. Since 2010, Li-ion battery costs have come down by 87% [1] and energy density has tripled [2]. Automake... » read more

Vehicle Communications Network Is Due For Overhaul
By Ann Mutschler - 07 May, 2020 - Comments: 1

The Controller Area Network (CAN), one of the main communications networks in an automobile, is headed for a security overhaul — if not a wholesale replacement. Initially devised in the 1980s to allow electronic components in a vehicle to communicate directly without a central computer in between, the CAN bus has become a growing security risk as more functions are automated and integrated... » read more

Making Sense Of PUFs
By Bryon Moyer - 07 May, 2020 - Comments: 3

As security becomes a principal design consideration, physically unclonable functions (PUFs) are seeing renewed interest as new players emerge onto the market. PUFs can play a central role in hardware roots of trust (HRoTs), but the messaging in the market can make it confusing to understand the different types of PUF as well as their pros and cons. PUFs leverage some uncertain aspect of som... » read more

IC Test Solutions For The Automotive Market
By Mentor, a Siemens Business - 06 May, 2020 - Comments: 0

The amount of electronic content in passenger cars continues to grow rapidly, driven mainly by the integration of various advanced safety features, which will increase further with the move towards fully autonomous vehicles. It is critical that these safety-related devices adhere to the highest possible quality and reliability requirements formalized in the ISO 26262 standard that is being rapi... » read more

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