tag: Siemens

Priorities Shift In IC Design
By Ann Mutschler - 16 Jan, 2020 - Comments: 0

The rush to the edge and new applications around AI are causing a shift in design strategies toward the highest performance per watt, rather than the highest performance or lowest power. This may sound like hair-splitting, but it has set a scramble in motion around how to process more data more quickly without just relying on faster processors and accelerators. Several factors are driving th... » read more

Moore’s Law, Supply Chains And Security
By Brian Bailey - 16 Jan, 2020 - Comments: 0

The debate about the future of Moore's Law continues, while other parts of the industry look for alternatives. In between, supply chains are being pulled in multiple directions, with safety and security often in the middle. All across the semiconductor industry, significant changes are underway. Some of these have been in the works for some time. Others are new or accelerating faster than an... » read more

CES 2020 Highlights New Automotive Tech
By Chet Babla - 16 Jan, 2020 - Comments: 0

Another year, another Consumer Electronics Show (CES) packed with innovative technology. In the many years I’ve been coming to the show, I’ve seen it evolve from a launchpad for the year’s mainstream devices – televisions, laptops, smartphones – to encompass all manner of smart devices within the home and beyond. As the head of automotive at Arm, it’s that ‘beyond’... » read more

Random Directed Low Power Coverage Methodology
By Mentor, a Siemens Business - 15 Jan, 2020 - Comments: 0

This paper proposes a low-power coverage methodology based on the recently introduced UPF 3.0 low-power information model HDL package. Verification engineers can use this approach to achieve low-power coverage closure earlier. We share relevant case studies and examples using the methodology to solve low-power verification problems. It also discusses the benefits of this approach and its advant... » read more

Blog Review: Jan. 15
By Jesse Allen - 15 Jan, 2020 - Comments: 0

Cadence's Paul McLellan looks back at the history of lithography, from its fundamental equation to multiple patterning and the challenges facing EUV today. Synopsys' Taylor Armerding warns that medical device security isn't keeping up with new threats, despite positive steps, due in part to lack of funding, delayed initiatives, and a focus on critical service delivery. In a video, Mentor'... » read more

Improving In-System Test With Tessent VersaPoint Test Point Technology
By Mentor, a Siemens Business - 14 Jan, 2020 - Comments: 0

This paper describes a new versatile test point technology called VersaPoint, which has been developed specifically to work with designs implementing mixed EDT/LBIST methodologies to reduce EDT pattern counts and improve Logic BIST (LBIST) test coverage. VersaPoint test points can reduce compressed pattern counts 2X to 4X beyond compression alone and improve LBIST test coverage beyond what is p... » read more

Making 3D Structures And Packages More Reliable
By Ed Sperling - 14 Jan, 2020 - Comments: 0

The move to smaller vertical structures and complex packaging schemes is straining existing testing approaches, particularly in heterogeneous combinations on a single chip and in multi-die packages. The complexity of these devices has exploded with the slowdown in scaling, as chipmakers turn to architectural solutions and new transistor structures rather than just relying on shrinking featur... » read more

Planning Ahead For In-System Test Of Automotive ICs
By Jeff Mayer - 14 Jan, 2020 - Comments: 0

Automobiles are increasingly more like electronic devices than mechanical platforms. As a share of the total cost of a car, electronics components have grown from about 5% in 1970 to 35% in 2010. Electronics are projected to account for 50% by 2030 (Deloitte, 2019). Some of the electronics are for passive operations, like display or In-Vehicle Infotainment (IVI) systems, but a growing proportio... » read more

Big Growth Areas: Connectivity, AI, Reliability
By Brian Bailey - 14 Jan, 2020 - Comments: 0

Connectivity and artificial intelligence (AI) will be the biggest drivers for 2020, with an emphasis on improved reliability across all areas. New standards, new applications, and new pressures being placed on old technology will created boundless opportunities for those ready to fill the need. Of course, there will also be a lot of carnage along the way, and we can expect to see a lot of that ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 10 Jan, 2020 - Comments: 0

Synopsys will acquire certain IP assets of INVECAS. The acquisition expands Synopsys' DesignWare Logic Library, General Purpose I/O, Embedded Memory, Interface and Analog IP portfolio. The acquisition will also add a team of experienced R&D engineers to focus on physical IP across a range of process technologies. INVECAS will retain its HDMI IP and ASIC Design Solutions businesses. The deal... » read more

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