中文 English

MaxLinear And Calibre RealTime Digital


MaxLinear implemented the Calibre RealTime Digital interface for fast, iterative, signoff DRC checking and fixing during floorplanning and placement. They not only reduce the total of batch DRC iterations, but also eliminate potential late-stage issues during final physical verification signoff that are exponentially harder to fix. Adopting the Calibre RealTime Digital interface enabled MaxLine... » read more

Custom Designs, Custom Problems


Semiconductor Engineering sat down to discuss power optimization with Oliver King, CTO at Moortec; João Geada, chief technologist at Ansys; Dino Toffolon, senior vice president of engineering at Synopsys; Bryan Bowyer, director of engineering at Mentor, a Siemens Business; Kiran Burli, senior director of marketing for Arm's Physical Design Group; Kam Kittrell, senior product management group d... » read more

New Approaches For Hardware Security


Semiconductor Engineering sat down to discuss a wide range of hardware security issues and possible solutions with Norman Chang, chief technologist for the Semiconductor Business Unit at ANSYS; Helena Handschuh, fellow at Rambus, and Mike Borza, principal security technologist at Synopsys. What follows are excerpts of that conversation. (L-R) Norman Chang, Helena Handschuh, Mike Borza. Pho... » read more

Signoff-Compatible CDC


Tanveer Singh, senior staff consulting applications engineer at Synopsys, explains why netlist clock domain crossing is now an essential complement to RTL CDC, why CDC issues are worse at advanced nodes and in AI chips, and why dealing with CDC effectively is becoming a competitive requirement for performance and low power. » read more

Verification In The Cloud


Christen Decoin, senior director of business development at Synopsys, talks with Semiconductor Engineering about what’s changed for EDA in the cloud, why it has taken so long, and what new benefits the cloud will offer. Rules have changed at foundries, and the customer base for designs is evolving. » read more

The Growing Uncertainty Of Sign-Off At 7/5nm


Having enough confidence in designs to sign off prior to manufacturing is becoming far more difficult at 7/5nm. It is taking longer due to increasing transistor density, thinner gate oxides, and many more power-related operations that can disrupt signal integrity and impact reliability.  For many years, designers have performed design rule checks as part of physical verification of the desi... » read more

Tech Talk: eFPGA Timing


Flex Logix's Chen Wang talks about timing for an embedded FPGA and how that differs from ASIC timing. https://youtu.be/n88D1N4IEbs » read more

Which Verification Engine? (Part 2)


Semiconductor Engineering sat down to discuss the state of verification with Jean-Marie Brunet, senior director of marketing for emulation at [getentity id="22017" e_name="Mentor, a Siemens Business"]; Frank Schirrmeister, senior group director for product management at [getentity id="22032" e_name="Cadence"]; Dave Kelf, vice president of marketing at [getentity id="22395" e_name="OneSpin Solut... » read more

System Coverage Undefined


When is a design ready to be taped out? That has been one of the toughest questions to confront every design team, and it's the one verification engineers lose sleep over. Exhaustive [getkc id="56" kc_name="coverage"] has not been possible since the 1980s. Several metrics and methodologies have been defined to help answer the question and to raise confidence that important aspects of a block... » read more

Addressing Thermal Reliability In Next-Gen FinFET Designs


The next generation of chips on the 10/7nm finFET processes will be able to cram more devices into same area while also boosting performance, but there's a price to pay for that. The 3D fin structures trap heat, so the the temperature rises on the device and there is no way to dissipate that heat. This combination of higher current density, higher performance and higher temperature has a det... » read more

← Older posts