Verification In The Cloud


Christen Decoin, senior director of business development at Synopsys, talks with Semiconductor Engineering about what’s changed for EDA in the cloud, why it has taken so long, and what new benefits the cloud will offer. Rules have changed at foundries, and the customer base for designs is evolving. » read more

The Growing Uncertainty Of Sign-Off At 7/5nm


Having enough confidence in designs to sign off prior to manufacturing is becoming far more difficult at 7/5nm. It is taking longer due to increasing transistor density, thinner gate oxides, and many more power-related operations that can disrupt signal integrity and impact reliability.  For many years, designers have performed design rule checks as part of physical verification of the desi... » read more

Tech Talk: eFPGA Timing


Flex Logix's Chen Wang talks about timing for an embedded FPGA and how that differs from ASIC timing. https://youtu.be/n88D1N4IEbs » read more

Which Verification Engine? (Part 2)


Semiconductor Engineering sat down to discuss the state of verification with Jean-Marie Brunet, senior director of marketing for emulation at [getentity id="22017" e_name="Mentor, a Siemens Business"]; Frank Schirrmeister, senior group director for product management at [getentity id="22032" e_name="Cadence"]; Dave Kelf, vice president of marketing at [getentity id="22395" e_name="OneSpin Solut... » read more

System Coverage Undefined


When is a design ready to be taped out? That has been one of the toughest questions to confront every design team, and it's the one verification engineers lose sleep over. Exhaustive [getkc id="56" kc_name="coverage"] has not been possible since the 1980s. Several metrics and methodologies have been defined to help answer the question and to raise confidence that important aspects of a block... » read more

Addressing Thermal Reliability In Next-Gen FinFET Designs


The next generation of chips on the 10/7nm finFET processes will be able to cram more devices into same area while also boosting performance, but there's a price to pay for that. The 3D fin structures trap heat, so the the temperature rises on the device and there is no way to dissipate that heat. This combination of higher current density, higher performance and higher temperature has a det... » read more

Tech Talk: 7nm Thermal Effects


ANSYS' Karthik Srinivasan talks about the effect of heat on reliability at advanced process nodes, including self-heating, circuit aging, and how that will affect automotive electronics. https://youtu.be/SS6iAXp0Kn8   Related Tech Talk: 7nm Power Dealing with thermal effects, electromigration and other issues at the most advanced nodes. » read more

When Is Verification Complete?


Deciding when verification is done is becoming a much more difficult decision, prompting verification teams to increasingly rely on metrics rather than just the tests listed in the verification plan. This trend has been underway for the past couple of process nodes, but it takes time to spot trends and determine whether they are real or just aberrations. The Wilson Research Group conducts a ... » read more

A Program Manager’s Guide to Successful Integrated Circuit Verification


Accurately monitoring progress on complex integrated circuit (IC) designs has become more difficult as the designs have increased in complexity, leading to surprises from backwards-looking reporting and management processes that do not forewarn coming crises. The Cadence Metric-Driven Verification Methodology provides a more uniform and standardized method of reporting progress towards closure ... » read more

Formal’s Roadmap


Formal verification has come a long way in the past five years as it focused on narrow tasks within the verification flow. Semiconductor Engineering sat down to discuss that progress, and the future of formal technologies, with [getperson id="11306" comment="Raik Brinkmann"], president and CEO of [getentity id="22395" e_name="OneSpin Solutions"]; Harry Foster, chief verification scientist at [g... » read more

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