What’s Missing For Designing Chips At The System Level


Semiconductor Engineering sat down to talk about design challenges in advanced packages and nodes with John Lee, vice president and general manager for semiconductors at Ansys; Shankar Krishnamoorthy, general manager of Synopsys' Design Group; Simon Burke, distinguished engineer at Xilinx; and Andrew Kahng, professor of CSE and ECE at UC San Diego. This discussion was held at the Ansys IDEAS co... » read more

Research on Wire Sweep of Integrated Circuit Packaging Based on Three-dimensional Flow Simulation


Abstract: "Semiconductor manufacturing technology is becoming more and more rapidly. In the process of Integrated Circuit (IC) encapsulation, when wires contact each other, it will cause short circuit. Wire sweep has become the main factor affecting the reliability of the product. Therefore, it is a great challenge to master wire sweep in IC packaging process. This paper takes Low Profile Fi... » read more

What’s Next For Emulation


Emulation is now the cornerstone of verification for advanced chip designs, but how emulation will evolve to meet future demands involving increasingly dense, complex, and heterogeneous architectures isn't entirely clear. EDA companies have been investing heavily in emulation, increasing capacity, boosting performance, and adding new capabilities. Now the big question is how else they can le... » read more

Materials and Device Simulations for Silicon Qubit Design and Optimization


Abstract: "Silicon-based microelectronics technology is extremely mature, yet this profoundly important material is now also poised to become a foundation for quantum information processing technologies. In this article, we review the properties of silicon that have made it the material of choice for semiconductor-based qubits with an emphasis on the role that modeling and simulation have play... » read more

Making Batteries Denser And Safer


Battery technology is improving swiftly, driven by the rapidly rising demand for electric vehicles and the vast body of knowledge developed by the semiconductor industry. The market for electric vehicles (EVs) is on a fast upward trajectory, with global sales predicted to grow more than 12 times to more than 31 million vehicles. In fact, EVs will account for almost a third of new vehicle sal... » read more

Reliable And Efficient Compact Models For Scalable MTJ Simulation


By Fernando García Redondo, Pranay Prabhat, and Mudit Bhargava Since its discovery in 1975, Tunnel-Magneto-Resistance (TMR) has been actively investigated. From the 2000s, advances in process technologies have made the miniaturization of Magnetic Random Access Memories (MRAMs) based on TMR devices possible, together with integration into traditional CMOS processes. Introducing magneti... » read more

Plasma processing for advanced microelectronics beyond CMOS


N. Marchack, L. Buzi, D. B. Farmer, H. Miyazoe, J. M. Papalia, H. Yan, G. Totir, and S. U. Engelmann , "Plasma processing for advanced microelectronics beyond CMOS", Journal of Applied Physics 130, 080901 (2021) https://doi.org/10.1063/5.0053666 ABSTRACT "The scientific study of plasma discharges and their material interactions has been crucial to the development of semiconductor process en... » read more

How Chips Will Change Health Care


Jo De Boeck, chief strategy officer and executive vice president at imec, sat down with Semiconductor Engineering to talk about the intersection of medical and semiconductor technology, what's changing in how chips are being used, and what will happen in the short term and long-term. What follows are excerpts of that discussion. SE: Medical technology never advanced at the rate everybody... » read more

Physics-Based Sensor Validation Via Ansys: Driving New Automotive Innovations


Autonomous driving is revolutionizing the global automotive industry. With every new model, cars are smarter and more capable of independently responding to external signals like lane markings, highway signs, other cars and pedestrians. However, formulating a correct response via artificial intelligence depends on flawless sensor performance. With so many sensors supporting the advanced driv... » read more

10X Higher Productivity With VCS Dynamic Test Loading


The verification of a system-on-chip (SoC) is becoming increasingly complex, due to the multitude of functionality being implemented on a single chip. Different verification techniques are required at each level (IP, block, SoC and system) for faster verification closure. A successful verification strategy requires reuse of functional tests, faster test development and faster debug to improve t... » read more

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