tag: simulation

Preparing For The Multiphysics Future Of 3D ICs
By Siemens EDA - 07 Nov, 2024 - Comments: 0

3D integrated circuits (3D ICs) are emerging as a revolutionary approach to design, manufacturing and packaging in the semiconductor industry. Offering significant advantages in size, performance, power efficiency and cost, 3D ICs are poised to transform the landscape of electronic devices. However, with 3D ICs come new design and verification challenges that must be addressed to ensure success... » read more

Managing Reflections With Terminations
By John Golding - 04 Nov, 2024 - Comments: 0

Have you heard recommendations to use a particular termination in particular situations for good signal integrity? Have you ever wondered how to incorporate terminations in your design? While there are typical use cases for various terminations, sometimes engineers use termination techniques based on a recommendation or assumption that may not work, or at least may not be optimal, for their par... » read more

Four Real-World Applications for Electromagnetic Simulation
By Keysight - 30 Oct, 2024 - Comments: 0

With the complexity of integrated circuit (IC) components increasing, electromagnetic (EM) circuit simulation is now critical for accurate and efficient design. The EM effects on a circuit can drastically alter voltage levels and damage semiconductor devices. With EM simulation, designers can account for EM effects on their circuit to avoid costly problems before they happen. EM simulation e... » read more

Simulation Replay Tackles Key Verification Challenges
By Robert Ruiz - 12 Sep, 2024 - Comments: 0

Simulation lies at the heart of both verification and pre-silicon validation for every semiconductor development project. Finding functional or power problems in the bringup lab is much too late, leading to very expensive chip turns. Thorough simulation before tapeout, coupled with comprehensive coverage metrics, is the only way to avoid surprises in silicon. However, the enormous size and comp... » read more

Challenges and Best Practices for TCO Models of Technical Computing Resources for Engineering Modeling and Simulation Workflows
By Ansys - 11 Sep, 2024 - Comments: 0

Many organizations focus heavily on the system’s initial capital cost when developing criteria and reviewing proposals for new procurements. While this is crucial for evaluating ROI, research shows that the initial purchase cost accounts for only half of the total expenses over the system’s useful life. This data point highlights the importance of understanding the total cost of ownership (... » read more

Intel and Cadence Collaboration on UCIe: Demonstration of Simulation Interoperability
By Cadence - 28 Aug, 2024 - Comments: 0

The Universal Chiplet Interconnect Express (UCIe) 1.0 specification was announced in early 2022. A new updated UCIe 1.1 specification was released on August 8, 2023. The standardized open chiplet standard allows for heterogeneous integration of die-to-die link interconnects within the same package. The UCIe standard allows for advanced package and standard package options to tradeoff cost, band... » read more

The Impact Of Simulation On The Carbon Footprint of Wafer Fab Equipment R&D
By Technical Paper Link - 13 Aug, 2024 - Comments: 0

A new technical paper titled "Achieving Sustainability in the Semiconductor Industry: The Impact of Simulation and AI" was published by researchers at Lam Research. Abstract "Computational simulation has been used in the semiconductor industry since the 1950s to provide engineers and managers with a faster, more cost-effective method of designing semiconductors. With increased pressure in t... » read more

Aeroacoustics Large-Eddy Simulation of VTOL Aircraft Design
By Cadence - 31 Jul, 2024 - Comments: 0

This conference paper, co-authored by Honda Motor Co. and Cadence, reveals  findings on the aeroacoustics predictions of multibladed vertical take-off and landing (VTOL) rotors using large-eddy simulations (LES). Why should you read this white paper? Advanced Simulations: We conducted simulations on VTOL rotors with two to five blades, assessing high-frequency noise predictions. Exp... » read more

Essential Insights for Design PCIe 6.0 Interconnects
By Keysight - 24 Jul, 2024 - Comments: 0

PCI Express (PCIe) is a serial communication protocol that has progressed through generations to enhance data rates and functionality. The latest version, PCIe 6.0, doubles the data rate to 64 GT/s, enabling up to 256 GB/s of bandwidth in an x16 configuration. The technology incorporates PAM4 signaling and forward error correction to maintain high speeds with improved signal integrity and relia... » read more

Digital Twins Find Their Footing In IC Manufacturing
By Laura Peters - 09 Jul, 2024 - Comments: 0

Momentum is building for digital twins in semiconductor manufacturing, tying together the various processes and steps to improve efficiency and quality, and to enable more flexibility in the fab and assembly house. The movement toward digital twins opens up a slew of opportunities, from building and equipping new fabs faster to speeding yield ramps by reducing the number of silicon-based tes... » read more

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