RISC-V’s Software Portability Challenge

By Brian Bailey - 13 Nov, 2024 - Comments: 0

Experts At The Table: RISC-V provides a platform for customization, but verifying those changes remains challenging. Semiconductor Engineering discussed the issue with John Min, vice president of customer service at Arteris; Zdeněk Přikryl, CTO of Codasip; Neil Hand, director of marketing at Siemens EDA (at the time of this discussion); Frank Schirrmeister, executive director for strategi... » read more

Reducing SoC Power With NoCs And Caches

By Andy Nightingale - 31 Oct, 2024 - Comments: 0

Today’s system-on-chip (SoC) designs face significant challenges with respect to managing and minimizing power consumption while maintaining high performance and scalability. Network-on-chip (NoC) interconnects coupled with innovative cache memories can address these competing requirements. Traditional NoCs SoCs consist of IP blocks that need to be connected. Early SoCs used bus-based archi... » read more

Chip Industry Week In Review

By The SE Staff - 16 Aug, 2024 - Comments: 0

The U.S. Department of Commerce and Texas Instruments (TI) signed a non-binding preliminary memorandum of terms to provide up to $1.6 billion in CHIPS Act funding towards TI’s investment of over $18 billion for three 300mm semiconductor wafer fabs under construction in Texas and Utah. TI also expects to get about $6 billion to $8 billion from the U.S. Department of Treasury’s Investmen... » read more

Why SoC Designers Need Purpose-Built Semiconductor IP Catalog Tools

By Roberto Piacentini Filho - 25 Jul, 2024 - Comments: 0

Semiconductor intellectual property (IP) management, reuse, and change tracking are essential for efficiently creating chip designs based on proven building blocks, reducing your time-to-market, and maintaining good reputations throughout their lifetimes. Unfortunately, many SoC teams attempt to use existing tools like Git for these essential tasks, even though they are unsuitable and inconv... » read more

Intel Vs. Samsung Vs. TSMC

By Ed Sperling - 15 Jul, 2024 - Comments: 3

The three leading-edge foundries — Intel, Samsung, and TSMC — have started filling in some key pieces in their roadmaps, adding aggressive delivery dates for future generations of chip technology and setting the stage for significant improvements in performance with faster delivery time for custom designs. Unlike in the past, when a single industry roadmap dictated how to get to the next... » read more

Resilient And Secure Programmable SoC Accelerator Offload (KAUST)

By Technical Paper Link - 03 Jul, 2024 - Comments: 0

A technical paper titled “Resilient and Secure Programmable System-on-Chip Accelerator Offload” was published by researchers at King Abdullah University of Science and Technology (KAUST). Abstract: "Computational offload to hardware accelerators is gaining traction due to increasing computational demands and efficiency challenges. Programmable hardware, like FPGAs, offers a promising plat... » read more

Competitive Open-Source EDA Tools

By Technical Paper Link - 19 May, 2024 - Comments: 0

A technical paper titled “Basilisk: Achieving Competitive Performance with Open EDA Tools on an Open-Source Linux-Capable RISC-V SoC” was published by researchers at ETH Zurich and University of Bologna. Abstract: "We introduce Basilisk, an optimized application-specific integrated circuit (ASIC) implementation and design flow building on the end-to-end open-source Iguana system-on-chip (... » read more

Cut Power+Cost 5–10x: Integrate FPGA In Your SoC

By Flex Logix - 08 May, 2024 - Comments: 0

You can integrate an FPGA in an SoC at full speed and flexibility. Until EFLX eFPGA, it was not possible to integrate full-speed, high-density FPGA in an SoC. Now you can. Click here to read more. » read more

Aeonic Generate GGM High Performance SoC Clock Generation Module

By Movellus - 24 Apr, 2024 - Comments: 0

Core counts have been increasing steadily since IBM's debut of the Power 4 in 2001, eclipsing 100 CPU cores and over 1,000 for AI accelerators. While sea of processor architectures feature a stamp and repeat design, per-core workloads aren't always going to be symmetrically balanced. For example, a cloud provider (AI or compute) will rent out individual core clusters to customers for specialize... » read more

Interconnects Essential To Heterogeneous Integration

By Karen Heyman - 28 Mar, 2024 - Comments: 0

Designing and manufacturing interconnects is becoming more complex, and more critical to device reliability, as the chip industry shifts from monolithic planar dies to collections of chips and chiplets in a package. What was once as simple as laying down a copper trace has evolved into tens of thousands of microbumps, hybrid bonds, through-silicon vias (TSVs), and even junctions for optical ... » read more

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Knowledge Centers
Entities, people and technologies explored

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Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

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by Ed Sperling

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by Laura Peters

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eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

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tag: SoC

RISC-V’s Software Portability Challenge

Reducing SoC Power With NoCs And Caches

Chip Industry Week In Review

Why SoC Designers Need Purpose-Built Semiconductor IP Catalog Tools

Intel Vs. Samsung Vs. TSMC

Resilient And Secure Programmable SoC Accelerator Offload (KAUST)

Competitive Open-Source EDA Tools

Cut Power+Cost 5–10x: Integrate FPGA In Your SoC

Aeonic Generate GGM High Performance SoC Clock Generation Module

Interconnects Essential To Heterogeneous Integration

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Knowledge Centers
Entities, people and technologies explored