tag: software

Addressing Design Challenges In Heterogeneous Multicore Embedded Systems
By Mentor, a Siemens Business - 27 May, 2015 - Comments: 0

Single-core processor designs for purpose-built devices used to rule the day. Now, heterogeneous multicore systems are quickly becoming the de facto architecture as devices are tasked to do more complex functions faster and more efficiently. In this paper, we’ll explore why hetero/multicore systems have become so popular and why many of our current procedures and practices must change if we a... » read more

Accelerating Development For LP
By Brian Bailey - 14 May, 2015 - Comments: 0

Power is a limiting factor in all devices these days, and while most of the industry has seen this coming for several process nodes and a succession of mobile devices with limited battery life, the power problem remains a work in progress. No matter how much progress is made—and there has been plenty of work done in the areas of multiple power domains, dark silicon, dynamic voltage and fr... » read more

Week 48: One Week Left For Early Registration
By Anne Cirkel - 08 May, 2015 - Comments: 0

I have to admit, writing the weekly blog has made the countdown to DAC a lot more apparent than it would have been otherwise. When I began blogging last year, I thought the watched-pot-never-boils maxim might apply, that time would drag and I’d run out of things to say months before the opening keynote. Instead, I’m fairly stunned to have just four more blogs to write until “my DAC year�... » read more

Internet Of Things Design Considerations For Embedded Connected Devices
By Mentor, a Siemens Business - 07 May, 2015 - Comments: 0

Embedded connectivity has been around since the early days of M2M. But what is new are the many complexities and emerging standards embedded system developers need to know if they are to design the latest IoT device. This paper delves into many of the key considerations developers need to know and discusses the critical areas of IoT security and connectivity along with the importance of a prove... » read more

What EDA’s Big 3 Think Now
By Ed Sperling - 23 Apr, 2015 - Comments: 0

In the past two months the CEOs of Cadence, Synopsys and Mentor Graphics delivered their annual high-level messages to their respective user groups. Semiconductor Engineering attended all of the speeches at these conferences, as it did in 2014 (see story here). From a high level, the big issues for CEOs last year were Moore's Law, the costs of design, the impact of low power, and business-... » read more

Pressure Builds To Revamp The Design Flow
By Ed Sperling - 23 Apr, 2015 - Comments: 1

Without [getkc id="7" kc_name="EDA"] there would be no [getkc id="74" comment="Moore's Law"] as we know it today, and without Moore's Law there would be a much more limited need for EDA. But after more than three decades of developing design flows packed with sophisticated tools to automate semiconductor design through verification, and thereby enable feature shrinks that are the basis of Moore... » read more

What Is Functional Accuracy?
By Ann Mutschler - 26 Mar, 2015 - Comments: 0

What it means to be functionally accurate in the context of [getkc id="104" kc_name="virtual platforms"] varies greatly, depending upon whom you ask and even when you ask them. But that doesn’t mean that functional accuracy isn’t useful. Jon McDonald, technical marketing engineer for the design and creation business at [getentity id="22017" e_name="Mentor Graphics"], expects to see a lot... » read more

Fast Followers And The Value of Virtual Prototyping
By Tom De Schutter - 26 Mar, 2015 - Comments: 0

I am writing this blog while traveling though China. In this country of opportunities, new electronics companies show up regularly and some of them are quickly growing to become leaders in their application domain. Of course it helps if your local market is as big, if not bigger, than the U.S. and European market combined. The advantage of being a fast follower is that you can learn from th... » read more

Thermal Is Still Simmering
By Ann Mutschler - 12 Mar, 2015 - Comments: 0

With the ever increasing sophistication in today’s high-performance [getkc id="81" kc_name="SoC"]s on top of sheer physics of device manufacturing, thermal is a much bigger concern than ever before. It is well understood that thermal and power are closely related, and there exists a vicious cycle between leakage power and temperature: leakage goes up, temperature goes up; temperature goes ... » read more

One-To-Many: Shifting Left, Adding Gears
By Brian Bailey - 12 Mar, 2015 - Comments: 3

[getperson id="11034" comment="Aart de Geus"], chairman and co-CEO of [getentity id="22035" e_name="Synopsys"], launched into high gear for his keynote talk at this year’s Design and Verification Conference (DVCon). The gathering attracted a record number of attendees, and it is estimated that about 350 people crammed into the room to listen to him talk about the shift left that is happening ... » read more

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