Manufacturing Bits: Oct. 23


3D stacked finFETs At the upcoming 2018 IEEE International Electron Devices Meeting (IEDM), Imec is expected to present a paper on a 3D stacked finFET architecture. IEDM is slated from Dec. 1-5 in San Francisco. Imec’s technology is based what on the R&D organization calls sequential integration. Another R&D organization, Leti, calls it 3D monolithic integration. Regardless, the idea... » read more

Collaboration And Advanced Substrates


Discussions of semiconductor manufacturing tend to focus on CMOS logic and memory devices, sometimes to the exclusion of everything else. Discussions of silicon-on-insulator wafer markets focus on the needs of high performance logic. Lithography analysts emphasize high density memories. It’s easy to forget that real systems contain other devices, too. A modern smartphone probably supports ... » read more

Week In Review: Manufacturing, Test


Trade wars The United States and China have escalated the ongoing trade war. Both sides have implemented 25% tariffs on $16 billion worth of each other’s goods, according to a report from Reuters. The U.S. and China have slapped a combined $100 billion in tariffs on products since early July, according to the report. In testimony before a U.S. government interagency panel on considering t... » read more

Week In Review: Design, Low Power


Wafer company Soitec and European missile manufacturer MBDA joined together to buy the assets of Dolphin Integration. The IP and EDA tool provider, founded in 1985 in Grenoble, France, has been struggling, recently concluding insolvency proceedings and going into receivership. The new joint venture will absorb Dolphin's 155 employees and be owned 60% by Soitec, 40% by MBDA. The two companies co... » read more

Manufacturing Bits: Aug. 21


World’s smallest transistor The Karlsruhe Institute of Technology (KIT) has developed what researchers say is the world’s smallest transistor. Researchers have devised a single-atom transistor. The transistor switches an electrical current via a single atom, which resides in a gel electrolyte. The device also works at room temperature. While others have developed single-atom transist... » read more

Where FD-SOI Works Best (Part 2)


Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

Leti’s Next Focus


Emmanuel Sabonnadière, chief executive of Leti, sat down with Semiconductor Engineering to discuss R&D trends, a new deal with Soitec, and the latest developments at the France-based research organization. Leti is a research institute of CEA Tech. What follows are excerpts of that conversation. SE: Leti recently formed an alliance with Soitec. Under the terms, Leti and Soitec are formin... » read more

FD-SOI Going Mainstream


Semiconductor Engineering sat down to discuss changes in the FD-SOI world and what's behind them, with James Lamb, deputy CTO for advanced semiconductor manufacturing and corporate technical fellow at Brewer Science; Giorgio Cesana, director of technical marketing at STMicroelectronics; Olivier Vatel, senior vice president and CTO at Screen Semiconductor Solutions; and Carlos Mazure, CTO at Soi... » read more

Week In Review: Manufacturing, Test


Chipmakers GlobalFoundries said that the company’s 22nm FD-SOI technology has delivered more than $2 billion worth of client design win revenue. With more than 50 total client designs, the technology is designed for automotive, 5G connectivity and the Internet of Things (IoT). Helic has announced that its electromagnetic (EM) modeling engine has been certified for GlobalFoundries’ 22nm ... » read more

Week In Review: Manufacturing, Test


Chipmakers and OEMs Fujitsu Semiconductor and United Microelectronics Corp. (UMC) announced that UMC will acquire all of the shares of Mie Fujitsu Semiconductor Limited (MIFS), a 300mm wafer foundry joint venture between both companies. In addition to the 15.9% of MIFS shares currently owned by UMC, Fujitsu Semiconductor will transfer the remaining 84.1% of its shares in MIFS to UMC, making MI... » read more

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