Similar But Different — The Tale Of Transient And Permanent Faults

By Siemens EDA - 05 Oct, 2022 - Comments: 0

When determining whether an IC is safe from random hardware faults, applying safety metrics such as PMHF, SPFM, and LFM, engineers must analyze both transient and permanent faults. This paper highlights the fundamental differences between permanent and transient faults on digital circuits, and why this distinction is important in the context of the ISO 26262:2018 functional safety standard. ... » read more

Functional Safety Verification Of Serial Peripheral Interface

By Technical Paper Link - 03 Oct, 2022 - Comments: 0

A new technical paper titled "FMEDA based Fault Injection to Validate Safety Architecture of SPI" was published by researchers at R.V. College of Engineering in India and Analog Devices. Abstract "The integration of advanced technologies into Electrical Vehicles (EV) has been increasing in recent times, so it has become crucial to evaluate the risk of the technologies that are deployed into... » read more

ISO 26262:2018 Fault Analysis In Safety Mechanisms

By OneSpin Solutions - 25 Nov, 2019 - Comments: 0

Authors: Jörg Grosse1, Mark Hampton1, Sergio Marchese1, Jörg Koch2, Neil Rattray1, Alin Zagardan2 1OneSpin Solutions, Munich, Germany 2Renesas Electronics Europe, Duesseldorf, Germany ISO 26262-5 requires the determination of hardware safety metrics, including SPFM and LFM. Latent and residual diagnostic coverage are also important metrics to assess the effectiveness of safety mechanisms... » read more

Reshaping Automotive Design

By Ann Mutschler - 04 Jan, 2018 - Comments: 0

The entire automotive ecosystem is being reshaped by vehicle electrification, assisted and autonomous driving, and the connectivity needed to make it all work. So far, it's not clear just how smoothly this will all come together. In this redefined world, electronics and software will provide differentiation rather than mechanical engineering and possibly even brand name, creating change on a... » read more

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Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

Legacy Process Nodes Going Strong

The critical, and growing, significance of mature node chips and processes.

by Bryon Moyer

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

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eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

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The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

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Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: SPFM

Similar But Different — The Tale Of Transient And Permanent Faults

Functional Safety Verification Of Serial Peripheral Interface

ISO 26262:2018 Fault Analysis In Safety Mechanisms

Reshaping Automotive Design

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