Addressing High Precision Automated Optical Inspection Challenges With 3D Technology


Driven by the continued decrease in the size of electronics packaging, combined with the increase in density, there is a critical need for highly accurate 3D inspection for defect detection. Using multi-view 3D sensors and parallel projection, it is possible to capture more of the board at a faster rate as compared to serial image acquisition which is more time consuming. Precise 3D image re... » read more

Resetting Serial Memory When A System Failure Occurs


Stability is an important consideration in embedded design, but electronic systems can suffer malfunctions triggered by a myriad of root causes. These include poor signal integrity, power spikes, software errors, and erroneous user interaction, just to name a few. These anomalies, in turn, can lead to inconsistent system operation or can even cause the system to hang. Although the list of po... » read more

Extending 3D MRS Sensor Technology To Address Challenging Measurement And Inspection Applications


There is an increasing need for highly accurate 3D inspection and measurement capabilities for applications in SMT, semiconductor and metrology markets. 3D Multiple Reflection Suppression (MRS) sensor technology has been effectively combined with Automated Optical Inspection for several years and is now being utilized for many SPI applications such as microelectronics and sub-100-micron sold... » read more

Using Automotive-Ready IP To Accelerate SoC Development


IP suppliers play a key role in the automotive supply chain to enable high-performance advanced driver assistance system (ADAS) SoCs. Vision-based SoCs may contain a high amount of third-party IP to implement the key embedded vision, sensor fusion, multimedia, security and advanced connectivity functions. And while IP suppliers have permeated the semiconductor ecosystem for consumer, mobile, PC... » read more