tag: SRAM

Comparing Analog and Digital SRAM In-Memory Computing Architectures (KU Leuven)
By Technical Paper Link - 01 Jun, 2023 - Comments: 0

A technical paper titled "Benchmarking and modeling of analog and digital SRAM in-memory computing architectures" was published by researchers at KU Leuven. Abstract: "In-memory-computing is emerging as an efficient hardware paradigm for deep neural network accelerators at the edge, enabling to break the memory wall and exploit massive computational parallelism. Two design models have surge... » read more

What Designers Need To Know About GAA
By Brian Bailey - 13 Apr, 2023 - Comments: 0

While only 12 years old, finFETs are reaching the end of the line. They are being supplanted by gate-all-around (GAA), starting at 3nm [1], which is expected to have a significant impact on how chips are designed. GAAs come in two main flavors today — nanosheets and nanowires. There is much confusion about nanosheets, and the difference between nanosheets and nanowires. The industry still ... » read more

Safeguarding SRAMs From IP Theft (Best Paper Award)
By Technical Paper Link - 15 Dec, 2022 - Comments: 0

A technical paper titled "Beware of Discarding Used SRAMs: Information is Stored Permanently" was published by researchers at Auburn University. The paper won "Best Paper Award" at the IEEE International Conference on Physical Assurance and Inspection of Electronics (PAINE) Oct. 25-27 in Huntsville. Abstract: "Data recovery has long been a focus of the electronics industry for decades by s... » read more

Scalable Optical AI Accelerator Based on a Crossbar Architecture
By Technical Paper Link - 08 Nov, 2022 - Comments: 0

A new technical paper titled "Scalable Coherent Optical Crossbar Architecture using PCM for AI Acceleration" was published by researchers at University of Washington. Abstract: "Optical computing has been recently proposed as a new compute paradigm to meet the demands of future AI/ML workloads in datacenters and supercomputers. However, proposed implementations so far suffer from lack of sc... » read more

Addressing SRAM Verification Challenges
By Siemens EDA - 26 Oct, 2022 - Comments: 0

SureCore Limited is an SRAM IP company based in Sheffield, the United Kingdom, that develops low power memories for current and next generation silicon process technologies. Its award-winning, world-leading, low power SRAM designs are process independent and variability tolerant, making them suitable for a wide range of technology nodes. Two major product families have been announced: PowerM... » read more

Computational SRAM (C-SRAM) Solution Combining In- and Near-Memory Computing Approaches
By Technical Paper Link - 23 May, 2022 - Comments: 0

New academic paper titled "Towards a Truly Integrated Vector Processing Unit for Memory-bound Applications Based on a Cost-competitive Computational SRAM Design Solution", from researchers at Univ. Grenoble Alpes, CEA-LIST. Abstract "This article presents Computational SRAM (C-SRAM) solution combining In- and Near-Memory Computing approaches. It allows performing arithmetic, logic, and co... » read more

Using Symbolic Simulation For SRAM Redundancy Repair Verification
By Hari Sathianathan - 27 Jan, 2022 - Comments: 0

Innovations in Very Deep Sub-Micron technologies, such as the advent of three-dimensional FinFET transistor structures, have facilitated the implementation of very large embedded SRAM memories in System-on-Chip (SoC) designs to the point where they occupy the majority of the chip die area. To get maximum memory capacity on the smallest die area, SRAM bitcells are designed with the minimum possi... » read more

Outlook: DRAM, NAND, Next-Gen Memory
By Mark LaPedus - 18 Nov, 2021 - Comments: 0

Jim Handy, director at Objective Analysis, sat down with Semiconductor Engineering to talk about the 3D NAND, DRAM and next-generation memory markets. What follows are excerpts of that discussion. SE: How would you characterize the NAND market thus far in 2021? Handy: All chips are seeing unusual strength in 2021, but NAND flash and DRAM are doing what they usually do by exhibiting more e... » read more

Challenges With Chiplets And Packaging
By Mark LaPedus - 15 Sep, 2021 - Comments: 0

Semiconductor Engineering sat down to discuss IC packaging technology trends, chiplets, shortages and other topics with William Chen, a fellow at ASE; Michael Kelly, vice president of advanced packaging development and integration at Amkor; Richard Otte, president and CEO of Promex, the parent company of QP Technologies; Michael Liu, senior director of global technical marketing at JCET; and Th... » read more

New Memories Add New Faults
By Bryon Moyer - 07 Sep, 2021 - Comments: 1

New non-volatile memories (NVM) bring new opportunities for changing how we use memory in systems-on-chip (SoCs), but they also add new challenges for making sure they will work as expected. These new memory types – primarily MRAM and ReRAM – rely on unique physical phenomena for storing data. That means that new test sequences and fault models may be needed before they can be released t... » read more

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