Week in Review: Iot, Security, Automotive

By Susan Rambo - 08 Nov, 2019 - Comments: 0

IoT STMicroelectronics is now supporting LoRaWAN firmware updates over the air (FUOTA) in the STM32Cube ecosystem. Microsoft is adding ANSYS Twin Builder to its Microsoft Azure Digital Twins software, which companies use to create digital twins of machinery and IoT devices that are deployed in remotely. The digital replica of actual devices helps companies predict when maintenance is needed... » read more

Power Semi Wars Begin

By Mark LaPedus - 23 Oct, 2019 - Comments: 1

Several vendors are rolling out the next wave of power semiconductors based on gallium nitride (GaN) and silicon carbide (SiC), setting the stage for a showdown against traditional silicon-based devices in the market. Power semiconductors are specialized transistors that incorporate different and competitive technologies like GaN, SiC and silicon. Power semis operate as a switch in high-volt... » read more

MEMS & Sensors Technical Congress Focuses on Automotive, Emerging MEMS

By Heidi Hoffman - 08 Feb, 2019 - Comments: 0

This year’s MEMS & Sensors Technical Congress (MSTC), February 19-20, 2019, features a deep dive into the changing automotive sensor landscape, a look at emerging MEMS technologies, and an exploration of integration standards. The more technically focused of SEMI’s annual MEMS events, MSTC returns to Monterey, California, in conjunction with FLEX, the conference that highlights new form... » read more

Placing Bets On Future Technology

By Ed Sperling - 16 Nov, 2015 - Comments: 0

Marie Semeria, CEO of Leti, sat down with Semiconductor Engineering to talk about where the French research and technology organization is placing its future technology bets and what's behind those decisions. What follows are excerpts of that discussion. SE: It's becoming more difficult and expensive to shrink features, so where do we go next? Semeria: We see several areas that we believe... » read more

Intel Acquires Docea Power

By Brian Bailey - 14 Aug, 2015 - Comments: 0

Intel has quietly done another EDA acquisition, this time buying Docea Power, a small company based in Moirans, France. Docea had high-level power and thermal estimation tools. The acquisition closed July 31st. [getentity id="22222" comment="Docea Power"] was founded by two brothers, [getperson id="11137" p_name="Ghislain"] and [getperson id="11138" p_name="Sylvian"] Kaiser. Ghislain had spe... » read more

The Week In Review: Design

By Ed Sperling - 16 May, 2014 - Comments: 0

M&A Synopsys’ Coverity subsidiary bought Kalistick, a French company that makes cloud-based solutions to boost testing efficiency by allowing engineers to identify and prioritize tests. Terms of the deal were not disclosed. Tools Cadence rolled out verification IP for the new PCI Express 4.0 architecture. The new spec supports up to 16 billion transactions per second, which is double... » read more

Bit Mapping

By Ed Sperling - 22 Feb, 2013 - Comments: 0

The rule of thumb for semiconductor manufacturing is that big breakthroughs tend to last a decade, or about five process nodes. While the transistor already has spanned more than five decades and the IC more than four decades, the technology used to create them typically only lasts about one. 193nm lithography has been around more than a decade. Bets were being made publicly back at 45nm—o... » read more

The Trouble With Power Models

By Ed Sperling - 08 Mar, 2012 - Comments: 0

By Ed Sperling Talk with any large systems vendor about power modeling and, with very few exceptions, they’re still using a mix of spreadsheets and lower-level models—no matter how far along they are in ESL adoption and in modeling other parts of an IC. Power has crept up on even the biggest companies, which have never really figured out how to implement it into their design flows. For ... » read more

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Knowledge Centers
Entities, people and technologies explored

Shift Left Is The Tip Of The Iceberg

A transformative change is underway for semiconductor design and EDA. New languages, models, and abstractions will need to be created.

by Brian Bailey

Partitioning In The Chiplet Era

Understanding how chiplets interact under different workloads is critical to ensuring signal integrity and optimal performance in heterogeneous designs.

by Ann Mutschler

3.5D: The Great Compromise

Pros and cons of a middle-ground chiplet assembly that combines 2.5D and 3D-IC.

by Ed Sperling

AI’s Role In Chip Design Widens, Drawing In New Startups

Focus is on letting engineers do much more with the same or fewer resources — and less drudgery.

by Karen Heyman

Key Technologies To Extend EUV To 14 Angstroms

Alongside high-NA EUV will be better-performing photoresists, reduced roughness using passivation and etch, and lateral etching to reduce tip-to-tip dimensions.

by Laura Peters

Memory Fundamentals For Engineers

eBook: Nearly everything you need to know about memory, including detailed explanations of the different types of memory; how and where these are used today; what's changing, which memories are successful and which ones might be in the future; and the limitations of each memory type.

by The SE Staff

What Comes After HBM For Chiplets

The standard for high-bandwidth memory limits design freedom at many levels, but that is required for interoperability. What freedoms can be taken from other functions to make chiplets possible?

by Brian Bailey

Why Small Fab And Assembly Houses Are Thriving

Megafabs churning out the most advanced processors are not the only game in town.

by Bryon Moyer

tag: ST Microelectronics