tag: standards

Experts At The Table: Stacked Die Reality Check
By Ed Sperling - 10 Sep, 2012 - Comments: 0

By Ed Sperling Semiconductor Manufacturing & Design sat down with Sunil Patel, principal member of the technical staff for package technology at GlobalFoundries; Steve Pateras, product marketing director at Mentor Graphics; Steve Smith, senior director of platform marketing at Synopsys; Thorsten Matthias, business development director at EVGroup; and Manish Ranjan, vice president of market... » read more

Experts At The Table: The Future Of SystemC
By Ed Sperling - 28 Jun, 2012 - Comments: 0

By Ed Sperling System-Level Design moderated a discussion about the future of SystemC with Thomas Alsop, corporate design solution expert at Intel; Ambar Sarkar, chief verification technologist at Paradigm Works; Mike Meredith, vice president of technical marketing at Forte Design Systems; David Black, certified training instructor at Doulos. Here are some of the key outtakes of that discussio... » read more

The Next Frontiers
By Ed Sperling - 24 May, 2012 - Comments: 0

One of the interesting things about technology is that, at least from the outside, it’s hard to tell what’s actually changing. That’s not true on the inside, of course, where radical shifts are under way. The next big push in smart phones will be much greater intelligence. In the iPhone, Siri was just the tip of the iceberg. Future versions are likely to be much more interesting. Add ... » read more

Standards: Too Many or Not Enough?
By Kiran Vittal - 10 May, 2012 - Comments: 0

Many of you are familiar with the Betamax versus VHS format wars in the late 1980s. If you’re not old enough to remember that one, you’ll remember HD DVD versus Blu-ray. In each of these cases, there was a clear winner. Semiconductor design has these format wars, too. The problem is that there is rarely a clear winner and worse, sometimes we miss the standard altogether. There are tw... » read more

Low Power: Coming To A CE Device Near You
By Ed Sperling - 21 Jul, 2011 - Comments: 0

By Pallab Chatterjee Low power and connectivity are the two pervasive design constraints for chips and systems being designed today, and they are showing up in devices that have not had architectural changes in decades. Some of the changes are customer-driven, some are consortia-driven, and international cooperation is making some of the regulatory-driven. The regulatory side is moving slow... » read more

Standards Wanted
By Ed Sperling - 30 Jun, 2011 - Comments: 0

Over the next few years, as the industry moves to stacked die of various sorts—2.5D, 3D, system-in-package, package-on-package, and probably some others we haven’t considered yet—there will be a major need for standards. We will need standards for placement, interconnects, power leakage, characterization of IP and a slew of other things we haven’t even thought about yet. Most compani... » read more

Power Model Complexity Grows
By Ed Sperling - 13 Jan, 2011 - Comments: 0

By Ed Sperling The number of factors required for an effective power model has far surpassed the capabilities of even the most detailed spreadsheet at 45nm and beyond. It has now entered the realm of complex databases and architectural tradeoffs, and those tradeoffs will become even more complex as 3D stacking takes root over the next 24 months. The idea of modeling power is hardly new, but... » read more

Standards Update
By Ann Mutschler - 18 Nov, 2010 - Comments: 0

By Ann Steffora Mutschler In the sometimes-murky waters of system-level modeling standards where real-world adoption can be difficult to track, work is progressing to help hardware and software engineers realize the promise of true hardware-software codesign. The three main standards efforts related to modeling at the system level are OSCI’s TLM-2.0, OCP-IP’s OCP and Open Modeling TAB a... » read more

Low-Power Standards Watch: Ethernet
By Ed Sperling - 04 Nov, 2010 - Comments: 0

By Colleen Taylor With a job that can legitimately count "the inherent constraints of quantum physics" as a major cause of workplace stress, engineers in the semiconductor industry have never exactly had it easy. But as policymakers focused on curbing emissions impose increasingly strict regulations on the power consumption of consumer electronic devices, a host of new challenges have emerged ... » read more

Experts At The Table: Evolving Standards
By Ed Sperling - 04 Sep, 2009 - Comments: 0

System-Level Design sat down with Keith Barkley, senior engineer in IBM’s systems and technology group; Steven Schulz, president and CEO of Silicon Integration Initiative (Si2); Yatin Trivedi, director of standards and interoperability programs at Synopsys; Ian Mackintosh, chairman of the OCP International Partnership (OCPIP), and Michael Meredith, vice president of technical marketing at For... » read more

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