tag: standards

Standards Wanted
By Ed Sperling - 30 Jun, 2011 - Comments: 0

Over the next few years, as the industry moves to stacked die of various sorts—2.5D, 3D, system-in-package, package-on-package, and probably some others we haven’t considered yet—there will be a major need for standards. We will need standards for placement, interconnects, power leakage, characterization of IP and a slew of other things we haven’t even thought about yet. Most compani... » read more

Power Model Complexity Grows
By Ed Sperling - 13 Jan, 2011 - Comments: 0

By Ed Sperling The number of factors required for an effective power model has far surpassed the capabilities of even the most detailed spreadsheet at 45nm and beyond. It has now entered the realm of complex databases and architectural tradeoffs, and those tradeoffs will become even more complex as 3D stacking takes root over the next 24 months. The idea of modeling power is hardly new, but... » read more

Standards Update
By Ann Mutschler - 18 Nov, 2010 - Comments: 0

By Ann Steffora Mutschler In the sometimes-murky waters of system-level modeling standards where real-world adoption can be difficult to track, work is progressing to help hardware and software engineers realize the promise of true hardware-software codesign. The three main standards efforts related to modeling at the system level are OSCI’s TLM-2.0, OCP-IP’s OCP and Open Modeling TAB a... » read more

Low-Power Standards Watch: Ethernet
By Ed Sperling - 04 Nov, 2010 - Comments: 0

By Colleen Taylor With a job that can legitimately count "the inherent constraints of quantum physics" as a major cause of workplace stress, engineers in the semiconductor industry have never exactly had it easy. But as policymakers focused on curbing emissions impose increasingly strict regulations on the power consumption of consumer electronic devices, a host of new challenges have emerged ... » read more

Experts At The Table: Evolving Standards
By Ed Sperling - 04 Sep, 2009 - Comments: 0

System-Level Design sat down with Keith Barkley, senior engineer in IBM’s systems and technology group; Steven Schulz, president and CEO of Silicon Integration Initiative (Si2); Yatin Trivedi, director of standards and interoperability programs at Synopsys; Ian Mackintosh, chairman of the OCP International Partnership (OCPIP), and Michael Meredith, vice president of technical marketing at For... » read more

Experts At The Table: Evolving Standards
By Ed Sperling - 27 Aug, 2009 - Comments: 0

System-Level Design sat down with Keith Barkley, senior engineer in IBM’s systems and technology group; Steven Schulz, president and CEO of Silicon Integration Initiative (Si2); Yatin Trivedi, director of standards and interoperability programs at Synopsys; Ian Mackintosh, chairman of the OCP International Partnership (OCPIP), and Michael Meredith, vice president of technical marketing at For... » read more

Easing System Creation With Embedded Hardware Solutions And Standards
By Cheryl Ajluni - 27 Mar, 2009 - Comments: 0

By Cheryl Ajluni System creation is today an ultra-complex task. On one hand, developers are confronted with consumer demands for ever more functionality, better performance and increased power efficiency at a lower cost. On the other hand, they face stringent time-to-market requirements and changing standards, coupled with the need to accommodate a range of requirements pertaining to differen... » read more

Trends in System-Level Prototyping
By Various Writers - 27 Mar, 2009 - Comments: 0

By Clive Maxfield One problem with electronics is that certain terms can mean different things, depending on who one is talking to at the time. Even worse, some terms have a tendency to evolve over time. This means that when we are presented with a topic like "Trends in System-Level Prototyping," before leaping headfirst into the fray, it may be a good idea to first define exactly what we mean... » read more

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