tag: Stanford University

More Knobs, Fewer Markers
By Ed Sperling - 16 Jan, 2020 - Comments: 0

The next big thing in chip design may be really big — the price tag. In the past, when things got smaller, so did the cost per transistor. Now they are getting more expensive to design and manufacture, and the cost per transistor is going up along with the number of transistors per area of die, and in many cases even the size of the die. That's not exactly a winning economic formula, which... » read more

Priorities Shift In IC Design
By Ann Mutschler - 16 Jan, 2020 - Comments: 0

The rush to the edge and new applications around AI are causing a shift in design strategies toward the highest performance per watt, rather than the highest performance or lowest power. This may sound like hair-splitting, but it has set a scramble in motion around how to process more data more quickly without just relying on faster processors and accelerators. Several factors are driving th... » read more

Power Complexity On The Rise
By Ann Mutschler - 14 Nov, 2019 - Comments: 0

New chip architectures and custom applications are adding significant challenges to chip design and verification, and the problems are becoming much more complex as low power is added into the mix. Power always has been a consideration in design, but in the past it typically involved different power domains that were either on, off, or in some level of sleep mode. As hardware architectures s... » read more

Revving Up For Edge Computing
By Ed Sperling - 07 Nov, 2019 - Comments: 1

The edge is beginning to take shape as a way of limiting the amount of data that needs to be pushed up to the cloud for processing, setting the stage for a massive shift in compute architectures and a race among chipmakers for a stake in a new and highly lucrative market. So far, it's not clear which architectures will win, or how and where data will be partitioned between what needs to be p... » read more

Power/Performance Bits: Oct. 1
By Jesse Allen - 01 Oct, 2019 - Comments: 0

Nighttime power Researchers at UCLA and Stanford University created a low-cost device that harnesses radiative cooling to provide a small amount of renewable energy at night. While the device only provides a small amount of power, it could be useful for areas without reliable electricity or access to batteries. Radiative cooling happens when a surface that faces the sky emits heat as therma... » read more

Week in Review – IoT, Security, Autos
By Jeff Dorsch - 27 Sep, 2019 - Comments: 0

Products/Services Achronix Semiconductor joined Taiwan Semiconductor Manufacturing’s IP Alliance Program, part of the foundry’s Open Innovation Platform. Achronix’s Speedcore eFPGA IP is available today on TSMC 16nm FinFET Plus (16FF+) and N7 process technologies, and it will be soon available on TSMC 12nm FinFET Compact Technology (12FFC). Cadence Design Systems announced that its di... » read more

System Bits: Sept. 3
By Jeff Dorsch - 03 Sep, 2019 - Comments: 0

Microprocessor built with carbon nanotubes Researchers at the Massachusetts Institute of Technology were able to design a microprocessor with carbon nanotubes and fabricate the chip with traditional processes, an advance that could be used in next-generation computers. Work on producing carbon nanotube field-effect transistors has gone on for some time. Fabricated at scale, those CNFETs oft... » read more

Manufacturing Bits: Aug. 27
By Mark LaPedus - 27 Aug, 2019 - Comments: 0

Holographic lithography Switzerland’s Nanotech SWHL GmbH has come out of stealth mode and disclosed its initial technology—a holographic lithography system. Founded in 2015, Nanotech SWHL has developed a sub-wavelength holographic lithography system that generates and prints 3D images on surfaces with one mask at one exposure. Still in R&D, the system is initially targeted for advanced ... » read more

System Bits: Aug. 27
By Jeff Dorsch - 27 Aug, 2019 - Comments: 0

A ring of 18 carbon atoms Scientists at IBM Research – Zurich and Oxford University write about allotropes of carbon – the many versions of atomic carbon formations, such as diamonds and graphite. “Carbon, one of the most abundant elements in the universe, can exist in different forms - called allotropes - giving it completely different properties from color to shape to hardness. For... » read more

Week in Review: IoT, Security, Autos
By Jeff Dorsch - 23 Aug, 2019 - Comments: 0

Products/Services Huawei Technologies is again delaying the public introduction of its Mate X foldable smartphone. It is unlikely the product will be marketed in the U.S., given the ongoing trade war. The official rollout now seems likely to come in November, in time for the holiday shopping season. Samsung Electronics has had its problems with foldable phones, yet those were due to manufactur... » read more

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