tag: Stanford University

What’s After 3D NAND?
By Mark LaPedus - 19 Sep, 2013 - Comments: 0

By Mark LaPedus Planar NAND flash memory is on its last scaling legs, with 3D NAND set to become the successor to the ubiquitous 2D technology. Samsung Electronics, for one, already has begun shipping the industry’s first 3D NAND device, a 24-level, 128-gigabit chip. In addition, Micron and SK Hynix shortly will ship their respective 3D NAND devices. But the Toshiba-SanDisk duo are the lo... » read more

Power/Performance Bits: Sept. 10
By Ann Mutschler - 10 Sep, 2013 - Comments: 0

Using DNA to assemble transistors from graphene Graphene is a sheet of carbon atoms arrayed in a honeycomb pattern, just a single atom thick. It could be a better semiconductor than silicon – if we could fashion it into ribbons 20 to 50 atoms wide. Could DNA help? Stanford chemical engineering professor Zhenan Bao, believes it could. Bao and her team of researchers hope to solve a problem... » read more

Power/Performance Bits: July 23
By Ann Mutschler - 23 Jul, 2013 - Comments: 0

Thinnest light absorber Expected to potentially reduce the cost and improve the efficiency of solar cells, Stanford University scientists report they have created the thinnest, most efficient absorber of visible light on record. The nanoscale structure is thousands of times thinner than an ordinary sheet of paper. The researchers said achieving complete absorption of visible light with a mi... » read more

New Incentives For Lowering Power
By Ed Sperling - 08 Nov, 2012 - Comments: 0

By Ed Sperling Despite all the focus by design teams on lowering power over the past few years, in many applications power is still the last consideration for many companies in the power-performance-area equation. That’s beginning to change, however, even for applications that in the past have not been particularly power-sensitive. There are several reasons for this shift. No. 1 on the li... » read more

The Hidden Costs Of Directed Self-Assembly
By Ed Sperling - 29 May, 2012 - Comments: 2

By Mark LaPedus Directed self-assembly (DSA) has been billed by some as a potential paradigm shift in semiconductor manufacturing, but it may not turn out to be quite the panacea its proponents suggest—or at least not yet. There are many questions surrounding DSA, an alternative lithography technology that makes use of block copolymers to enable fine pitches. Key among those questions ar... » read more

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