Chip Industry Week In Review


By Gregory Haley, Jesse Allen, and Liz Allan TSMC told equipment vendors to delay deliveries of the most advanced tools due to uncertain demand, according to Reuters. The news drove down stock prices of all the major equipment providers. On the other hand, TSMC said advanced packaging shortages will constrain AI chip shipments for the next 18 months, according to NikkeiAsia. The United St... » read more

Technical Paper Roundup: Sept 5


New technical papers added to Semiconductor Engineering’s library this week. [table id=132 /] (more…) » read more

An Open-Source Hardware Design And Specification Language To Improve Productivity And Verification 


A technical paper titled “PEak: A Single Source of Truth for Hardware Design and Verification” was published by researchers at Stanford University. Abstract: "Domain-specific languages for hardware can significantly enhance designer productivity, but sometimes at the cost of ease of verification. On the other hand, ISA specification languages are too static to be used during early stage d... » read more

Week In Review: Auto, Security, Pervasive Computing


Hyundai, Samsung Catalyst Fund, and others invested a combined $100 million in Canada-based Tenstorrent to accelerate the design and development of AI chiplets and machine-learning software and allow the integration of AI into future Hyundai, Kia, and Genesis vehicles, plus other future mobilities such as robotics and advanced air mobility (AAM). The National Highway Traffic Safety Administr... » read more

Chip Industry’s Technical Paper Roundup: July 5


New technical papers recently added to Semiconductor Engineering’s library: [table id=114 /] (more…) » read more

Leveraging Quantum Light Within Deployable Quantum Sensors


A technical paper titled “Integrated quantum optical phase sensor in thin film lithium niobate” was published by researchers at Stanford University and NTT Research. Abstract: "The quantum noise of light, attributed to the random arrival time of photons from a coherent light source, fundamentally limits optical phase sensors. An engineered source of squeezed states suppresses this noise a... » read more

Chip Industry’s Technical Paper Roundup: June 27


New technical papers added to Semiconductor Engineering’s library this week. [table id=113 /]   » read more

Improving Performance Of Artificial Intelligence And Quantum Computers


A technical paper titled “Gate-tunable superconducting diode effect in a three-terminal Josephson device” was published by researchers at University of Minnesota, University of California Santa Barbara, and Stanford University. Abstract: "The phenomenon of non-reciprocal critical current in a Josephson device, termed the Josephson diode effect, has garnered much recent interest. Realizati... » read more

Week In Review: Automotive, Security, Pervasive Computing


Stellantis and Foxconn formed a 50/50 joint venture called SiliconAuto, to be headquartered in the Netherlands. The goal is to close the gap between supply and demand for chips used in computer-controlled features and modules, especially for electric vehicles (EVs). The U.S. Department of Justice created a National Security Cyber Section within its National Security Division to increase the ... » read more

Week In Review: Design, Low Power


Renesas Electronics completed its acquisition of Panthronics, a fabless company specializing in near-field communication (NFC) wireless products. Renesas has already incorporated Panthronics NFC technology into several solution reference designs for applications such as payment, IoT, asset tracking, and smart meters. The European Commission announced new funding for the semiconductor and mic... » read more

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