tag: static timing analysis

3D Extraction Necessities For 5nm And Below
By Ruben Molina - 25 Jan, 2018 - Comments: 0

For most of my career in product marketing I’ve been focused on Static Timing Analysis (STA). It was, and still is, an area with a diverse set of topics including graph based analysis and path based analysis, on-chip variation modeling, delay calculation, evolving library models, etc. During those years I always understood that  parasitic extraction was a crucial element of STA and more impo... » read more

Full AMS Design Flow For The IoT
By Mentor, a Siemens Business - 27 Aug, 2015 - Comments: 0

By Nicolas Williams and Jeff Miller The pressure for a new generation of (analog/mixed-signal) AMS design capabilities has been accelerated by the sudden demand for Internet of Things (IoT). These inexpensive devices are used in an expanding array of scenarios on the edge of the network — thus the demand for an AMS design environment that is affordable and easy to use, but powerful enough ... » read more

Gate-Level Simulation Methodology
By Cadence - 26 Aug, 2015 - Comments: 0

The increase in design sizes and the complexity of timing checks at 40nm technology nodes and below is responsible for longer run times, high memory requirements, and the need for a growing set of gate-level simulation (GLS) applications including design for test (DFT) and low- power considerations. As a result, in order to complete the verification requirements on time, it becomes extr... » read more

Experts At The Table: The Growing Signoff Headache
By Ed Sperling - 31 May, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss signoff issues with Rob Aitken, an ARM fellow; Sumbal Rafiq, director of engineering at Applied Micro; Ruben Molina, product marketing director for timing signoff at Cadence; Carey Robertson, director of product marketing for Calibre extraction at Mentor Graphics; and Robert Hoogenstryd, director of marketing for design... » read more

Experts At The Table: The Growing Signoff Headache
By Ed Sperling - 09 May, 2013 - Comments: 0

By Ed Sperling Low-Power/High-Performance Engineering sat down to discuss signoff issues with Rob Aitken, an ARM fellow; Sumbal Rafiq, director of engineering at Applied Micro; Ruben Molina, product marketing director for timing signoff at Cadence; Carey Robertson, director of product marketing for Calibre extraction at Mentor Graphics; and Robert Hoogenstryd, senior director of marketing for ... » read more

Rounding Up Design Corners
By Ed Sperling - 25 Mar, 2010 - Comments: 0

By Pallab Chatterjee With advanced process development occupying the 32nm to 22nm corridor, production SoC and ASIC designs are being built at the 180nm to 45nm nodes. In these processes, the designer has to contend with cross-wafer variation and non-correlated design corners, as well as multiple operation states. This is referred to as multi-corner multi-mode (MCMM) and variation analysis. ... » read more

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