tag: STMicroelectronics

Marangoni Effect-Based Under-Layer For A Dual Damascene Via-First Approach
By Brewer Science - 17 Feb, 2021 - Comments: 0

One of the main challenges of a Dual Damascene (DD) via-first process is the control of the Critical Dimensions (CDs) in the lithography of the trenches. The PhotoResist (PhR) thickness presents variations from the via arrays to the open areas, which cause the variation of CDs: the swing effect. The planarization of a DD via-first process is reported. A dual-layer solution is used to demonstrat... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 04 Dec, 2020 - Comments: 0

Security The United States Department of Defense added China's SMIC to its blacklist for its alleged cooperation with the Chinese military, reports Reuters. U.S. investors are asked not to invest in SMIC, among 35 other companies based in China on the list. Intel Labs launched the Private AI Collaborative Research Institute with Avast and Borsetta, to advance and develop technologies in pri... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 27 Nov, 2020 - Comments: 0

Market research VLSI Research has raised its forecast for semiconductors and fab equipment in 2020. In its previous forecast, VLSI Research projected that the equipment market would reach $84.8 billion in 2020, up 10.1% over 2019. Now, in its latest forecast (See page 2), the equipment market is projected to hit $89.8 billion in 2020, up 16.6%. “The equipment business is booming,” said ... » read more

Week In Review: Design, Low Power
By Jesse Allen - 20 Nov, 2020 - Comments: 0

Synopsys acquired Light Tec, a provider of optical scattering measurements and measurement equipment. The company also provides optical engineering consulting services plus training for use of Synopsys' lighting simulation software. "Light Tec's proven optical measurement capabilities provide our customers with robust new tools for high-accuracy optical product simulations and visualizations," ... » read more

Smart Manufacturing In Fabs
By Jean-Marc Philippe - 19 Nov, 2020 - Comments: 0

Not long after STMicroelectronics opened its first semiconductor plant in Singapore more than 50 years ago, a facility chiefly focused on chip assembly and packaging, the company realized that it had constructed the site in an area with a blossoming chip ecosystem with a bright future. Before long, the company became the first to start a wafer fab facility in the so-called Little Red Dot. To... » read more

Blog Review: Nov. 11
By Jesse Allen - 11 Nov, 2020 - Comments: 0

Mentor's Chris Spear proposes mixing together the compactness of the field macro style with the preciseness of the do methods when writing a UVM transaction class. Cadence's Paul McLellan looks back at the history of EPROM, some of the difficulty with actually erasing it, and the subsequent development of EEPROM. Synopsys' Tuomo Untinen explains three WPA2 authentication vulnerabilities r... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 16 Oct, 2020 - Comments: 0

Chipmakers and OEMs Intel is exiting the NAND flash market. SK Hynix and Intel announced that they have signed an agreement on Oct. 20, under which SK Hynix would acquire Intel’s NAND memory and storage business for $9 billion.The transaction includes the NAND SSD business, the NAND component and wafer business, and the Dalian NAND memory manufacturing facility in China. Intel will retain it... » read more

Week In Review: Manufacturing, Test
By Mark LaPedus - 17 Jul, 2020 - Comments: 0

Chipmakers TSMC posted mixed results in the quarter, although the news was generally positive. The foundry giant raised its capital spending plans. “Our second quarter business was sequentially flat, as the continued 5G infrastructure deployment and HPC-related product launches offset weaknesses in other platforms,” said Wendell Huang, vice president and CFO at TSMC. “Moving into third q... » read more

Week In Review: Auto, Security, Pervasive Computing
By Susan Rambo - 17 Jul, 2020 - Comments: 0

Arm's parent company, Japanese tech conglomerate Softbank, reportedly is considering a sale or IPO of its Arm subsidiary, which it purchased in 2016 for $32 billion in cash. Considering that Arm chips are in most smart phones, as well as an increasing number of computers and IoT and edge devices, this development is being closely followed by most of the tech world. Last week, Softbank directed ... » read more

Design For Narrowband IoT
By Ann Mutschler - 20 May, 2020 - Comments: 0

Most low-power chips are designed with the assumption that batteries can be recharged or replaced, but there is a whole set of IoT devices under development that are expected to be always-on, communicate over a cellular infrastructure, and remain functional on a coin-sized lithium-ion battery for a decade or more. Welcome to the world of Narrowband IoT (NB-IoT), a 3GPP standard (also known a... » read more

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