Experts At The Table: Concurrent Design


Low-Power Engineering sat down with Marco Brambilla, ASIC design manager at STMicroelectronics; Charlie Janac, president and CEO of Arteris; Mike Gianfagna, vice president of marketing at Atrenta, and Javier DeLaCruz, director of semiconductor packaging at eSilicon. What follows are excerpts of that discussion. LPE: Is concurrent design strategic—meaning is it done at the architectural lev... » read more

Experts At The Table: Concurrent Design


Low-Power Engineering sat down with Marco Brambilla, ASIC design manager at STMicroelectronics; Charlie Janac, president and CEO of Arteris; Mike Gianfagna, vice president of marketing at Atrenta, and Javier DeLaCruz, director of semiconductor packaging at eSilicon. What follows are excerpts of that discussion. LPE: Is there cross-training going on to allow for concurrent design? Brambilla... » read more

Concurrent Design


The idea of developing software and hardware simultaneously isn't new, but it has taken on renewed urgency in IC design because of growing complexity, including power and proximity issues. Low-Power Engineering captures the perspective of executives at four companies working in this market: Marco Brambilla of STMicroelectronics; Charlie Janac of Arteris; Mike Gianfagna of Atrenta, and Javier De... » read more

Healthy Living Electronics Dominated By Power


By Pallab Chatterjee The theme for this years ISSCC (International Solid State Circuits Conference) is “Electronics for Healthy Living.” In addition to the new microprocessors, memory and data converter technologies, the focus and keynotes are directed toward health-care products. The common theme between all the talks is that health-care is being driven by mobility, information flow, a... » read more

Experts At The Table: Concurrent Design


Low-Power Engineering sat down with Marco Brambilla, ASIC design manager at STMicroelectronics; Charlie Janac, president and CEO of Arteris; Mike Gianfagna, vice president of marketing at Atrenta, and Javier DeLaCruz, director of semiconductor packaging at eSilicon. What follows are excerpts of that discussion. LPE: What is concurrent design and how has the definition changed? DeLaCruz: Th... » read more

Version Control Nightmares


By Ed Sperling The rampant re-use of IP and the growing reliance on software to smooth over glitches is creating a nightmare in version control of everything from IP blocks to EDA tools. Version control has always been a problem in SoC design, of course. Tools have to be in sync with engineering teams that are spread across multiple continents and working on different pieces of the design e... » read more

Bridging IP With Verification Standards


By Ann Steffora Mutschler Standards body Accellera is sounding the gong to summon all verification IP providers to check out its efforts in connection with IP-XACT -- IEEE 1685, "Standard for IP-XACT, Standard Structure for Packaging, Integrating and Re-Using IP Within Tool-Flows” – with verification IP. The IP-XACT technical committee has been busy over the past year. Formerly an effor... » read more

User Perspective: Hardware-Software Co-Design


By Ann Steffora Mutschler With software teams today twice as large as hardware teams for any given complex SoC project, there is no doubt it is an ideal time to agree on the best way for these worlds to intersect. And even though the semiconductor industry has been actively discussing hardware-software co-design for at least a decade a mainstream solution has yet to be commercialized. Progr... » read more

End User Report: EDA Industry Realignment


By Ann Steffora Mutschler The EDA industry has seen a number of large acquisitions as of late, most notably of Denali by Cadence, as well as CoWare, VaST and Virage Logic which were acquired by Synopsys, but just what impact does this realignment have on the biggest EDA customers? Commenting on these changes is Jean-Marc Chateau, director of system platforms and tools at STMicroelectronics, ... » read more

Design For Variability


By Ed Sperling Faced with shrinking margins, manufacturing process fluctuations that could mean one more or one less atom in a transistor and proximity issues in layout the most advanced chipmakers have begun designing for variability. Rather than working with fixed numbers, such as voltage, power and area, the goal of DFV is basically averaging all of these numbers. While this includes som... » read more

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